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Failure Analysis Techniques

EAG scientists and engineers utilize a comprehensive array of advanced failure analysis techniques to perform investigations on a broad range of electronic samples including integrated circuits, components,  systems, and commercial products..

We are problem solvers. Our experts will discuss the project with you and design an analysis plan appropriate for the investigation. We leverage the vast analytical disciplines within EAG Laboratories to deliver comprehensive solutions and results, to include:

 

Electrical Analysis
  • Electrical Verification (ATE, Bench Test, Temperature, Device Characterization)
  • Curve trace (IV family of curves)
  • Parametric and functional test
  • Product validation
  • RF characterization
  • Time Domain Reflectometry (TDR)
  • Transmission Line Pulse (TLP)
Package Integrity
Decapsulation
  • Laser Decapsulation
  • Laser Ablation
  • Cu wire
  • Advanced packaging (stacked die, multi-chip module, embedded devices, mounted on PCB)
  • CSP extraction from module and re-ball
  • Die extraction
  • Stacked die separation
  • Jet etch/chemical
  • Mechanical de-lid
  • Oxygen plasma
Optical Inspection
  • Bright and dark field imaging
  • Nomarski Differential Interference Contrast (DIC)
  • Near-IR inspections through silicon
Fault Isolation
  • Backside sample preparation and analysis
  • Laser Signal Injection Microscopy (XIVA, OBIRCH, Lock-in Mode, 1340nm, 1064nm)
  • Infrared (IR) Thermography (Pulse modulation mode, hot spot, temperature map)
  • Light Emission Microscopy (LEM) or EMMI (InGaAs, Deep Depletion CCD)
  • Microprobing and Picoprobing
  • FIB Circuit Edit and probe points
  • Dopant Profiling (AFP SCM)
Physical Analysis
  • Reactive Ion Etch (RIE)
  • Deprocessing/de-layering (chemical and mechanical)
  • Scanning Electron Microscopy (SEM, FE SEM)
  • Energy Dispersive X-ray Spectroscopy (EDS) spot, dot map and line scan
  • Scanning Transmission Electron Microscopy (STEM)
  • Dual Beam Focused Ion Beam (DB FIB) with GDS navigation and EDS analysis
  • Ion Milling and Polish
  • Metallurgical cross-sectioning (die, package, PCB, product)
  • Dye and Pry (solder joint integrity)
  • Bond Strength Test (pull and shear)
  • Construction and Competitor Analysis (process technology and node)