Atomic Force Microscopy, AFM Analysis

Atomic Force Microscopy (AFM Analysis), provides images with atomic or near-atomic-resolution surface topography, capable of quantifying surface roughness of samples down to the angstrom-scale. In addition to presenting a surface image, AFM can also provide quantitative measurements of feature sizes, such as step heights and other dimensions. Additionally, magnetic force Atomic Force Microscopy (AFM) technique from EAGmicroscopy (MFM), which is a variation of AFM, is capable of mapping the magnetic domains of samples.

Examples of Atomic Force Microscopy applications include:

  • Assessing wafers (SiO2, GaAs, SiGe, etc.) before and after processing
  • Determining processing effects (e.g. plasma treatment) on biomedical devices such as contact lenses, catheter and coated stents.
  • Examining the impact of surface roughness on adhesion
  • Assessing trench shape/cleanliness on patterned wafers
  • Determining whether morphology is the source of surface hazes


Atomic Force Microscopy Analysis by EAG

 

 

 

 

 

 

 

 

 

  • Three-dimensional surface topographic imaging, including surface roughness, grain size, step height, and pitch
  • Imaging of other sample characteristics, including magnetic field, capacitance, friction, and phase

Signal Detected: Topography

Vertical Resolution: 0.1Å

Imaging/Mapping: Yes

Lateral Resolution/Probe Size: 15-50Å

  • Quantifying surface roughness
  • Whole wafer analysis (up to 300mm)
  • High spatial resolution
  • Imaging of conducting and insulating samples
  • Scan range limits: 100µm laterally (xy) and 5µm vertically in z-direction
  • Potential problems with extremely rough or oddly shaped samples
  • Tip-induced errors are possible
  • Aerospace
  • Automotive
  • Biomedical/biotechnology
  • Compound Semiconductor
  • Data Storage
  • Defense
  • Displays
  • Electronics
  • Industrial Products
  • Lighting
  • Pharmaceutical
  • Photonics
  • Polymer
  • Semiconductor
  • Photovoltaics
  • Telecommunications
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