Industries
Services

Pharmaceutical & Biopharmaceutical Development Services

EAG brings unparalleled expertise to the development and commercialization of small molecule drugs, biopharmaceuticals, antibody-drug conjugates (ADCs), drug-device combination…

EAG brings unparalleled expertise to the development and commercialization of small molecule drugs, biopharmaceuticals, antibody-drug conjugates (ADCs), drug-device combination products and other therapies. From designing IND-enabling studies to delivering full CMC analytical and QC support, we join your R&D team as a true partner. EAG scientists take time to understand both your commercial goals and the unique characteristics of your compound. We provide expert guidance to balance regulatory expectations with expediency and cost, and approach technical challenges with flexibility and resolve.

Materials Testing & Analysis

When it comes to understanding the physical structure, chemical properties and composition of materials, no scientific services company offers the breadth of experience, diversity…

When it comes to understanding the physical structure, chemical properties and composition of materials, no scientific services company offers the breadth of experience, diversity of analytical techniques of technical ingenuity of EAG. From polymers to composites, thin films to superalloys—we know how to leverage materials sciences to gain a competitive edge. At EAG, we don’t just perform testing, we drive commercial success—through thoughtfully designed investigations, technically superior analyses and expert interpretation of data.

Environmental Testing & Regulatory Compliance

Having helped develop the test methods that shape current regulatory guidelines, EAG chemists, biologists and toxicologists have evaluated the environmental impact of thousands of…

Having helped develop the test methods that shape current regulatory guidelines, EAG chemists, biologists and toxicologists have evaluated the environmental impact of thousands of active ingredients and formulations—from pesticides and pharmaceuticals to industrial chemicals and consumer products. Whether you are exploring “what if” scenarios, registering a new active ingredient or formulation, responding to a data call-in or seeking to understand the latest guidance, turn to EAG for technical excellence, sound advice, GLP-compliant study execution and expert interpretation.

Microelectronics Test & Engineering

Whether connecting the internet of things, guiding surgical lasers or powering the latest smart phone, integrated circuits and microelectronics touch nearly every aspect of human…

Whether connecting the internet of things, guiding surgical lasers or powering the latest smart phone, integrated circuits and microelectronics touch nearly every aspect of human life. In the world of technology, innovation and continuous improvement are imperatives—and being able to quickly and reliably test, debug, diagnose failures and take corrective action can make the difference between a doomed product launch and building a successful global brand. EAG offers you the world’s largest and most diverse collection of specialized analytical instrumentation, capacity to perform a variety of microelectronic tests in parallel, and the multi-disciplinary expertise required to draw true insight from data.

Custom Synthesis & Radiolabeling

No contract service provider has more experience performing custom synthesis and producing isotopically labeled compounds to support product development in life science, chemical…

No contract service provider has more experience performing custom synthesis and producing isotopically labeled compounds to support product development in life science, chemical and related industries than we do. From 14C and 3H radiolabeled clinical trial materials synthesized under cGMP, to stable-labeled active ingredients for metabolism and environmental fate/effects testing, turn to EAG. We have extensive experience with multi-step and other complex synthesis projects, and our comprehensive, in-house analytical services ensure quick turnaround of purity and structural confirmation.

Crop Biotechnology & Development

EAG combines biotechnology and protein characterization expertise with more than 50 years' experience analyzing chemical compounds in plant and environmental matrices to address…

EAG combines biotechnology and protein characterization expertise with more than 50 years’ experience analyzing chemical compounds in plant and environmental matrices to address the growing needs of the biotechnology crop industry. We offer a wide range of techniques required to fully characterize the event insertion and expressed proteins, as well as the various studies required to confirm the food, feed and environmental safety of products that represent the trait. From early-stage protein confirmation to GLP-compliant EDSP and allergenicity testing, we help you make faster, more informed development decisions and comply with evolving global regulations of genetically engineered crops.

Litigation Support & Expert Testimony

When you need solid science and investigative engineering to address product failures, inform legal strategy, protect intellectual property or address product liability disputes,…

When you need solid science and investigative engineering to address product failures, inform legal strategy, protect intellectual property or address product liability disputes, turn to EAG. We’ve provided technical consulting, analysis and expert testimony for hundreds of cases involving the aerospace, transportation, medical device, electronics, industrial and consumer product industries. Our team of experts understands the legal process and your need for responsiveness, effective communication, scientifically defensible opinion and confidentiality. From professional consulting to data review to trial preparation and expert witness testimony, ask EAG.

Techniques

Chromatography

Using an array of advanced separation techniques and innovative technology, we conduct highly precise analytical chromatography for various industries. Whether you want a closer…

Using an array of advanced separation techniques and innovative technology, we conduct highly precise analytical chromatography for various industries. Whether you want a closer look at the purity of your pharmaceutical or need to better understand an agrochemical’s components, EAG has the expertise to separate and evaluate any compound.

Mass Spectrometry

Need to evaluate the molecular structure of a compound or identify its origins? EAG knows how. With state-of-the-art tools, we can separate, vaporize and ionize the atoms and…

Need to evaluate the molecular structure of a compound or identify its origins? EAG knows how. With state-of-the-art tools, we can separate, vaporize and ionize the atoms and molecules in almost any pure or complex material to detect and obtain mass spectra of the components. We rely on decades of experience in mass spectrometry to provide our clients with precise analyses and the best detection limits.

Imaging

EAG is a world leader in high-resolution imaging down to the atomic level. We offer unmatched analytical know-how, generating extremely detailed surface and near surface images…

EAG is a world leader in high-resolution imaging down to the atomic level. We offer unmatched analytical know-how, generating extremely detailed surface and near surface images for various industries, from consumer electronics to nanotechnology. Using state-of-the-art equipment and innovative techniques, we conduct expert imaging to aid in failure analysis, dimensional analysis, process characterization, particle identification and more. If you want to investigate a material with angstrom scale resolution, you can count on EAG to get the job done quickly and precisely.

Spectroscopy

EAG offers a vast array of spectroscopic techniques to clients in various industries, from defense contractors to technology pioneers. We combine unparalleled expertise and…

EAG offers a vast array of spectroscopic techniques to clients in various industries, from defense contractors to technology pioneers. We combine unparalleled expertise and methodology with cutting-edge technology to analyze your organic, inorganic, metallic and composite materials for identification, compositional, structural and contaminant information. Whether you need expert spectroscopic analysis to improve your production process or to surmount a technical challenge, EAG is up to the task.

Physical/Chemical Characterization

Need to identify your unique material? Want to analyze the thermal properties of a sample, or measure the success of a process step? If it has to be done quickly and it has to be…

Need to identify your unique material? Want to analyze the thermal properties of a sample, or measure the success of a process step? If it has to be done quickly and it has to be done right, you can count on EAG. We offer a range of adaptable techniques and innovative methods to evaluate the physical and chemical characteristics of any compound. Our highly precise testing and analytical services will improve your production process, expedite R&D and help you conquer any technical challenge.

About

A Global Scientific Services Company

One of the most respected names in contract research and testing, EAG Laboratories is a global scientific services company operating at the intersection of science, technology and…

One of the most respected names in contract research and testing, EAG Laboratories is a global scientific services company operating at the intersection of science, technology and business. The scientists and engineers of EAG apply multi-disciplinary expertise, advanced analytical techniques and “we know how” resolve to answer complex questions that drive commerce around the world.

Our Customers

Science and technology transcend industry boundaries, and so does demand for EAG’s expertise. We partner with companies across a broad spectrum of high-tech, high-impact and…

Science and technology transcend industry boundaries, and so does demand for EAG’s expertise. We partner with companies across a broad spectrum of high-tech, high-impact and highly regulated industries. We help our customers innovate new and improved products, investigate manufacturing problems, perform advanced analyses to determine safety, efficacy and regulatory compliance, and protect their brands.

Our Company Culture

EAG’s corporate culture is firmly rooted in four guiding principles: “foster a growth mindset,” “find a better way,” “earn more loyal customers,” and “win…

EAG’s corporate culture is firmly rooted in four guiding principles: “foster a growth mindset,” “find a better way,” “earn more loyal customers,” and “win together.” Across all of our 20+ locations, you will find a true passion for science and the power of science to improve the world we live in. Hear what some of our ~1200 scientists, engineers and support personnel say about what it means to be part of EAG Laboratories.

Careers

EAG is growing, and we are always looking for talented, problem-solving oriented individuals to join our company. If you have a “we know how” spirit, we want to hear from you.…

EAG is growing, and we are always looking for talented, problem-solving oriented individuals to join our company. If you have a “we know how” spirit, we want to hear from you. Browse current openings now, and re-visit our careers page often.

How do you constantly innovate while driving down costs?

Burn-in & Reliability Qualification

Reliability qualification demonstrates the fitness of a microelectronic product or IC for use in the field and helps our clients better understand the fundamental wear-out mechanisms, detect design marginality combined with parameter drift and determine failure rates due to latent manufacturing defects. EAG provides stress-based reliability qualification and knowledge based reliability qualification methodologies based on industry standards. These reliability testing techniques include High Temperature Operating Life Test (HTOL), Thermal Shock, Preconditioning, Temperature Humidity Bias, Highly Accelerated Temperature and Humidity Stress Test (HAST), and more.  We can customize the test conditions to meet your IC qualification needs.

We also have an in-house PCB design and assembly services team for any burn-in boards, HAST boards, or custom fixtures that may be required. EAG has optimized our services so no matter if you need maximum value and fast response or complete outsourced services, EAG’s experienced Reliability Engineers can create qualification plans and perform testing to meet your requirements with strict adherence to applicable JEDEC and MIL-STD specifications.

Our burn-in & reliability qualification lab is one of the finest in the country with over 75 chambers & ovens, tight ESD safety controls, routine audits, and a dedicated engineering staff to provide you with all of the burn-in, package qualification, process qualification, and other reliability data you need. Our lab service procedures are ISO 17025 accredited and DSCC certified. We follow industry standards, such as JEDEC, Mil-Std, AEC, as well as customer specific requirements. All equipment uses N.I.S.T. traceable tooling and monitored, calibrated profiles.

Stress-Based Testing Stress based qualification methodology provides a broad approach to identifying ic failure mechanisms and is a powerful tool to help engineers identify devices that may fail under normal use conditions. Thermal cycling, bias/humidity stress testing are conditions which many products experience and test conditions are designed to accelerate failures compared to field conditions.

Knowledge Based Testing Knowledge based qualification methodology is based upon detecting and understanding specific failure mechanisms. When a failure mechanism is known, accelerated testing can be designed to detect those failures prior to placing a product in the field.

Our testing methods include:

Moisture/Reflow Sensitivity Classification

This test is used to determine the classification level of non-hermetic solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly, solder reflow attachment, and/or repair operations. This will determine the classification level that should be used in Preconditioning.  Applicable Spec: IPC/JEDEC J-STD-020

Preconditioning

Preconditioning is to measure the resistance of non-hermetic surface mount devices to worst-case moisture absorption followed by one cycle of the soldering process and two cycles of rework. A statistical sample of parts is inspected with an acoustic microscope before and after preconditioning. Before they undergo the temperature humidity bias test, the temperature cycle test, the thermal shock test, the pressure cooker test or the highly-accelerated temperature and humidity stress test, surface mount devices are subjected to preconditioning and must later pass a final electrical test. Applicable Spec: JESD22-A113

HTOL - High Temperature Operating Life Test

High temperature operating life (HTOL) test is to determine the reliability of products by accelerating thermally activated failure mechanisms. Customer parts are subjected to elevated temperatures under biased operating conditions. Typically, dynamic signals are applied to the devices under stress. The typical Vcc is the maximum operating voltage. The test is used to predict long term failure rates. All test samples must pass final electrical test prior to HTOL testing. Applicable Specs: JESD22-A108, MIL-STD-883 Method 1005.8, EIAJ-ED4701-D323.

HTSL - High Temperature Storage Life Test

The high-temperature storage life test measures device resistance to a high-temperature environment that simulates a storage environment. The stress temperature is typically set to 125°C or 150°C to accelerate the effect of temperature on the test samples. In the test, no voltage bias is applied to the devices. Applicable Specs: JESD22-A103, MIL-STD-883 Method 1008

Temperature Cycling

Temperature cycle testing accelerates fatigue failures within a specific die and packaging system. Typical failure mechanisms include die cracking; package cracking, wire bond failure, and first or second level interconnect solder fatigue. The temperature cycling is done in one, two, or three chamber systems that control the air temperature and ramp rate. Ten different temperature conditions and four different soak modes are specified, and the combination of temperature condition and soak mode depends on customer requirements. Applicable Specs: JESD22-A104, MIL-STD-883 Method 1010.7

Thermal Shock

Thermal shock testing is similar to temperature cycle testing, except that in thermal shock tests an additional stress is provided: a sudden change in temperature due to a rapid transfer time. Thus the test can detect failure mechanisms caused by temperature transients and temperature gradients. The system has two inert fluorocarbon baths that are maintained at the temperature extremes described in the spec. Four different combinations of bath temperatures and dwell times are specified, and EAG engineers can help you choose the conditions that are applicable for your part. Applicable Specs: JESD22-A106, MIL-STD-883 Method 1011.9

 

2nd Level Interconnect Testing

Air to air temperature cycling of customer supplied test vehicles is performed to determine the performance and reliability of 2nd level solder joints. This type of testing establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. Applicable Specs: IPC 970.

Temperature Humidity Bias

The temperature-humidity-bias test is an environmental test designed to accelerate corrosion and dendritic growth. This is an alternative to the High Temperature and Humidity Stress Test (HAST). Although bias is applied, the part is typically put in a low power state to accelerate the failure mechanisms of interest while minimizing self-heating.

The duration of the test is 1008 hours, with readouts (final electrical tests) at 168 hours and 504 hours during the test. The stress temperature is 85°C, and the relative humidity is 85%. Testing should be performed no later than 48 hours after the end of ramp-down.

The bias voltage is typically the maximum operating voltage. Two kinds of bias may be applied depending on which one is more severe: continuous bias or cycled bias.

Samples of surface mount devices must undergo preconditioning and pass a final electrical test prior the THB test.

We have temperature-humidity test chambers that meet the requirements called out in the JESD22-A100D standard including the temperature, relative humidity, and ramp conditions.  Please contact us to learn more or submit your product for testing. Applicable Specifications and Standards: JESD22-A100D, EIAJ-IC-121-17.

HAST - Highly Accelerated Temperature and Humidity Stress Test

The highly accelerated temperature and humidity stress test (HAST) accelerates the same failure mechanisms as the 85°C/85% relative humidity test. The typical test conditions are 130°C/85% relative humidity, under pressure, and non-condensing. The test accelerates the penetration of moisture through the external protective material (encapsulated or seal) or along the interface between the external protective material and the metallic conductor, which pass through it. Samples of surface mount devices are subjected to preconditioning and a final electrical test prior to the highly accelerated temperature and humidity stress test. Applicable Specs: JESD22-A110 (biased), JESD22-A118 (unbiased).

Autoclave or Pressure Cooker Test

The Autoclave or pressure cooker test for ICs is an environmental test that measures a samples resistance to moisture penetration. It is an unbiased highly accelerated test that employs conditions of pressure, humidity and temperature to force moisture into the package. The test conditions are 121°C/100% relative humidity, under pressure, with moisture condensation.

Samples of surface mount devices are subjected to preconditioning and a final electrical test prior to the pressure cooker test. After the pressure cooker test, the leads of the test samples can be cleaned before the final electrical test.  Testing should be performed no later than 48 hours after the end of ramp-down.

This test is typically used to evaluate new IC packages or when changes have been made to the materials of the package. The autoclave test helps uncover weaknesses in the package such as delamination or metallization corrosion.  The purpose of the unbiased autoclave test is to evaluate the moisture resistance of non-hermetic IC packages and identify failures inside the package.

Our Autoclave chamber meets the JESD22-102 standards for a pressure chamber that can maintain a specified temperature and relative humidity.  Although 96 hours is typical for this test, conditions can range from 24 hours (Condition A) through 336 hours (Condition F).

Other tests that are part of Reliability Qualification can include: Preconditioning, HTOL, HTSL, Temperature Cycling and Thermal Shock. Applicable Specifications and Standards: JESD22-A102, EIAJ-IC-121-1.

Mechanical Tests

EAG conducts a variety of mechanical tests on product packages to evaluate robustness. These tests include:

  • Physical Dimensions (Method B100)
  • Mark Permanency
  • Lead Integrity (Method B105)
  • Solderability (Method B102)
  • Resistance to Soldering Heat (Method B106 — Conditions A and B)
  • Resistance to Solvents (Method B107)
  • Die Shear / Bond Strength
  • Mechanical Shock (Method B104)
  • Vibration, Variable Frequency (Method B103)

 

Hermetic Package Testing

EAG performs both Fine Leak and Gross Leak testing of packages.  Seal integrity testing is crucial for hermetic packages in military, space, and commercial applications. A loss of hermeticity is a reliability concern and will allow moisture and contaminants to enter the package cavity shortening device lifetime.

Both Gross Leak and Fine Leak testing are performed per MIL-STD 883.

CSP Reliability Qualification

System miniaturization, especially in consumer electronics market, is driving the development of advanced packaging technologies to accommodate products that are thinner, smaller, and consume less power. This has increased the use of Chip Scale Packages (CSPs), which are essentially the same size as the die. CSP substrates are also getting thinner to support the electronics they go inside.

Unfortunately, the size advantages that make CSPs so attractive also make them fragile and susceptible to damage during handling. This can result in chipping, cracking and ball damage from handling or socketing.

In general, the CSP reliability qualification process must address four key issues:

  • Handling
  • Incoming and outgoing quality control (IQC/OQC)
  • Socketing
  • Unbiased stress testing

EAG has developed the solution to these challenges using a combination of a) specialized processes, b) carriers and other custom fixtures as an alternative to sockets and daughter cards, when needed, and c) operator training covering all aspects of the qualification process.