Laser Decap at EAG

Device as received, The system

Decapped with aid of laser, PC board top view

Stitch bonds exposed by laser, PCB after laser exposed traces for probing and cutting

Good stitch bond top down, Slightly lifted stitch top down

Good stitch bond 45 degree tilt, Slightly lifted stitch bond 45 degree tilt

Broken stitch bond 45 degree tilt, Broken stitch bond top down

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