Laser Decap at EAG

Device as received, The system
Decapped with aid of laser, PC board top view
Stitch bonds exposed by laser, PCB after laser exposed traces for probing and cutting
Good stitch bond top down, Slightly lifted stitch top down
Good stitch bond 45 degree tilt, Slightly lifted stitch bond 45 degree tilt
Broken stitch bond 45 degree tilt, Broken stitch bond top down

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