Dr. Daniel J. D. Sullivan of EAG Laboratories discusses the relationship between reliability testing and failure analysis, as applied electronic and semiconductor devices, originally presented to the IEEE Reliability Society, Santa Clara Valley Chapter on May 4, 2017.
The relationship between reliability testing and failure analysis is vital and symbiotic. Reliability testing is done for a wide variety of reasons. After failures are obtained, determining the failure’s causes, validating and verifying the related issues leads to developing corrective actions. Performing comprehensive failure analysis and finding corrective action is preferable to living with failures, retrying tests and hoping for better results, or making random changes to design and processing and repeating the testing.
Dr. Sullivan presents a variety of standard reliability test methods, the issues they address and the typical failures found and the methods used to find them
About the presenter:
Dr. Sullivan is a Failure Analysis Manager at EAG Laboratories. He manages the FA lab, helping clients determine the causes of failures and apply corrective actions. He earned his Ph.D. in Chemistry from the University of California, San Diego and has over thirty years of experience, beginning with Surface Science Labs, and internal labs from Philips Semiconductors to startups like SolFocus. He has written 19 papers and presented several technical talks on FA and materials processes.
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