Package Delayering Services

PCB or Package samples can be delayered and examined at each layer. Package delayering is helpful in looking for as well as design rule distances with in such samples. Packages can also be removed to allow analysis from the backside of die.

Low mag X-ray top view of package Zoom-in X-ray top view
Package Delayering: low mag x-ray top view of package
Package Delayering: zoom in x-ray top view
Solder ball side of device          Side view X-ray
Package Delayering: solder ball side of device
Package Delayering: side view x-ray

The device is then polished away layer by layer so that examination, images and analysis can be performed as needed.

View of layer 4 traces View of layer 4 to layer 3 plated thru hole vias
Package Delayering: view of layer 4 traces
Package Delayering: view of layer 4 to layer 3 plated thru hole vias
View of Layer 3 traces View of layer 3 to layer 2 plated thru hole vias
Package Delayering: view of layer 3 traces
Package Delayering: view of layer 3 to layer 2 plated thru hole vias
View of Layer 2 traces View of layer 2 to layer 1 plated thru hole vias
Package Delayering: view of layer 2 traces
Package Delayering: view of layer 2 to 1 plated thru hole vias
View of Layer 1 traces  View of stitch bonds that go to the top of the die surface
Package Delayering: view of layer 1 traces
Package Delayering: view of stitch bonds that go to the top of the die surface

The exposure of the die and the wire bonds allows Emission/OBIRCH/IR techniques to be applied to the device.

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