PCB or Package samples can be delayered and examined at each layer. Package delayering is helpful in looking for as well as design rule distances with in such samples. Packages can also be removed to allow analysis from the backside of die.
|Low mag X-ray top view of package||Zoom-in X-ray top view|
|Solder ball side of device||Side view X-ray|
The device is then polished away layer by layer so that examination, images and analysis can be performed as needed.
|View of layer 4 traces||View of layer 4 to layer 3 plated thru hole vias|
|View of Layer 3 traces||View of layer 3 to layer 2 plated thru hole vias|
|View of Layer 2 traces||View of layer 2 to layer 1 plated thru hole vias|
|View of Layer 1 traces||View of stitch bonds that go to the top of the die surface|
The exposure of the die and the wire bonds allows Emission/OBIRCH/IR techniques to be applied to the device.
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