Decap services at EAG involve wet chemical etches to remove the plastic encapsulant on devices to allow inspection of the die. These involve precavitation by laser followed by the use of various acid solutions. Devices with aluminum or gold bond wires are standard and those with copper wires require a more involved process. Devices may be decapped individually or while mounted on a PCB.
|Decap of Au bond wire device||Close up of the pads|
|Decap of Cu bond wire device||Close up of the pads|
|Decap of device with Al bond wires||Close up of wire attach|
|Decap with lead fingers exposed||Close up of Lead Fingers|
To enable certain features and improve your experience with us, this site stores cookies on your computer. Please click Continue to provide your authorization and permanently remove this message.