Decap Services

Decap services at EAG involve wet chemical etches to remove the plastic encapsulant on devices to allow inspection of the die. These involve precavitation by laser followed by the use of various acid solutions. Devices with aluminum or gold bond wires are standard and those with copper wires require a more involved process. Devices may be decapped individually or while mounted on a PCB.

Decap of Au bond wire device	Close up of the pads
Decap of Cu bond wire device	Close up of the pads

Decap of device with Al bond wires	Close up of wire attach
Decap with lead fingers exposed	Close up of Lead Fingers