EAG LABORATORIES SERVICES

Advanced Microscopy Services use advanced imaging techniques such as SEM, TEM, or dual beam SEM that can be combined with elemental mapping capabilities such as EDS.

Enhanced SIM services offers more than 40 Secondary Ion Mass Spectrometry instruments with the best detection limits and layer structure identification.

Advanced Spectroscopy services include microscopy techniques such as Raman, FTIR, NMR, OES, XRD, and XRF that can identify a materials composition.

The root cause analysis of a product failure may include investigation of premature breakage, identifying an unexpected odor, or deprocessing a semiconductor device.

Materials characterization includes Mechanical testing, Surface analysis, Metallurgical analysis, Physical Analysis, compositional analysis, and thin film analysis.

Chemical Analysis includes Composition, Polymer or Failure Analysis, Contamination, or Materials identification, Deformulation, and Custom Synthesis.

Purity Analysis uses trace elemental techniques such as GD-MS, ICP-MS, ICP-OES, and LIBS to understand the chemical contamination of advanced materials.

Electronics Test & Reliability includes ATE, ESD testing, Failure Analysis, FIB Circuit Edit, Burn-in & REL, PCB Design, and Warpage Analysis.

Biomedical analysis of medical devices, and pharmaceuticals that utilize a complex set of chemistries and materials is important to ensure patient safety.

Warpage Analysis allows for measurement of warpage and deformation of products that are subjected to thermal stresses and produces a 3D profile.

Bring our scientific experience into the courtroom with trial preparation and expert witness testimony for intellectual property or product liability challenges.

Our consulting team can help you choose the right material for your application, investigate the composition of a film, or accelerate a manufacturing process.