Microscopy Techniques in the Failure Analysis of Optoelectronics
EAG divides FA tasks into three levels. In each level, we employ optimal techniques for device characterization, defect localization, and root cause failure analysis.
Residual Gas Analysis for Hermetically Sealed Devices
To be hermetically sealed essentially means to be airtight so that nothing can come in or get out (i.e., gas, moisture, liquid, etc.).
Capabilities of Eurofins EAG Materials Science Europe
Our laboratories in France and the Netherlands offer materials testing for industries including semiconductor, consumer electronics, lighting, aerospace and healthcare.
Understanding Energy Density in Batteries
There is still so much to learn about batteries, including challenges such as energy density, cycle life, fast charge, and safety. In this blog, we’ll be focusing on energy density.
Elemental Composition using XRF
XRF is a non-destructive technique that is used to quantify the elemental composition of materials.
FTIR and Raman – Composition and Contamination Analysis
FTIR and Raman are spectroscopy techniques that provide molecular information from various types of materials.
Failure Analysis of Medical Device Electronics
As medical devices become more complex, there are many more opportunities for things to go awry. Identifying, diagnosing, and remedying failures becomes dramatically more challenging. We can help.
Increase the Reliability of Products in the Field with DPA
High reliability electronic components like integrated circuits are often required to operate for long periods of time, having little or no opportunity for replacement.
Characterization of Crystalline structures – SEM-EBSD vs TEM-PED
Besides images provided by SEM and TEM, different attachments can be added to reveal crystalline information, including (SEM-EBSD) and TEM (TEM-PED).
Dual Beam FIB-SEM: Sample prepping and Imaging
The Dual Beam FIB-SEM integrates a focused ion beam with a scanning electron microscope for simultaneous sample prepping and imaging.
Failure Analysis in Aerospace Advancement
In the aerospace industry, electronics are subjected to extreme environmental variables. EAG’s failure analysis group can help solve potential problems that may arise.
Accurate Composition and Quantification of Materials – RBS
RBS is the one technique where we can really say that the composition and concentration are accurately determined for thin films.
When Images Aren’t Enough – EDS and EELS
EDS and EELS can be coupled with SEM, STEM and TEM to determine the elemental composition, spatial distribution and segregation of elements.
A Picture is Worth a Thousand Words – TEM, STEM and AC-STEM
TEM, STEM and AC-STEM techniques deliver high resolution images providing a detailed view of a material or product.
Plasma FIB – A better alternative to traditional FIB?
PFIB differs from traditional FIB in that it uses various gases such as Xe, Ar, oxygen or nitrogen to generate a plasma that is used to remove material from a sample.
Ceramic Matrix Composites Emerge as Next Generation Aerospace Materials
One way to combat rising fuel costs in the aerospace industry and improve efficiency is to use new advanced materials such as Ceramic Matrix Composites (CMCs).
When Innovation Meets Failure Analysis
In our interconnected and changing world, it is important to know how to respond to potential electronic system failures.
Using ICP-MS to Measure Elemental Compositions in Drug Products
ICP-MS is a multi-elemental bulk chemical analysis technique that can determine simultaneously up to 70 elements in a single sample.
Advances with Gallium Oxide
Gallium oxide has the potential to replace or substitute gallium nitride for power conversion in electric trains and vehicles.
Amorphous vs. Crystalline Materials
Solids fall under two main categories: amorphous and crystalline. These two types of solids have different properties that may be more beneficial for certain products or applications.
Lithium ion Batteries: Opportunities and Challenges
EAG scientists are leaders in the lithium-ion batteries recycling arena. EAG is a valuable resource in understanding these materials.
Cracking of Molded Components
An injection molded component in a consumer product was found to have an increased failure rate over a three-month period.
Delamination of Food Packaging
A client wanted to investigate the delamination of food packaging multilayer laminate. Roll stock did not meet seal strength specification.
Effects of Surface Roughness
The roughness of a surface and how it interacts with surrounding materials and elements can have a significant impact on material technology and its functionality.
FIB Circuit Edit can help during chip shortages
FIB Circuit Edit provides the ability to quickly perform nano-surgury by cutting traces or adding metal connections at the chip level
Incompatible Contaminant in Tubing
A device manufacturer observed defects in a lot of thermoplastic tubing. The tubing exhibited signs chemical attack or exposure to heating.
Molded In Stresses
Cracks were observed in transparent thermoformed plastic packaging during visual quality checks. Failures occured in specific material lots.
Off-Odor Memory Foam
Analytical testing to support changes in raw materials and processing conditions used in manufacturing memory foam, as well as odor
Weathering Polymeric Films
Polymeric films used in an outdoor application experienced reduced adhesion over time. The client suspected that UV degradation was occurring.
From Certifications To Customer Audits, Quality Matters
EAG Laboratories pursues quality in all aspects of our work for customers. ISO certifications and ongoing audits serves many market sectors.
Curing Issues with Silicone Adhesive
A client requested assistance to investigate a recurrent issue with the curing failure of a silicone adhesive joint between metal components.
When Temperature Matters – Cryo TEM
Cryo TEM involves performing TEM analysis while keeping the sample at cryogenic temperatures, around -170°C.
Polymer Case Study: Blistering Paint
Blisters were observed in paint applied to steel plates that had undergone treatment with a corrosion inhibitor. An investigation was performed to determine if there was evidence of contamination on the inside of the blister.
Analyzing Red LEDs with PCOR-SIMS
Televisions, computer screens, cell phone screens etc. are getting clearer, sharper, brighter and use much less power. This is all possible through LEDs.
Aerospace Materials Testing for Tunnel Junction Solar Cells
Aerospace Materials Testing for Tunnel Junction Solar Cells Science has opened many doors in its advancement over the centuries.
More Than Testing – Your One Stop Shop
Developing a reliable product has many challenges due to the desire for increased capability, reduction in formfactor, and managing the supply chain.
High Detection Sensitivity at the Nanoscale Level – APT
APT is a nanoscale materials analysis technique that provides 3D spatial imaging and chemical composition measurements with high sensitivity simultaneously.
Meeting Material Purity Requirements with GDMS
Unwanted chemical impurities can be problematic. GDMS is a powerful full survey analysis tool for chemical purity evaluations.
A Deep Dive into Dynamic SIMS vs. static-SIMS
Different types of SIMS analyses exist. The two main types include Dynamic SIMS (high current) and static-SIMS (low current).
Elemental Depth Profiling Analysis for the Aerospace & Defense Industry
EAG Scientists utilize GDMS analysis to perform Elemental Depth Profiling for chemical purity evaluations for aerospace & defense.
Is my surface clean? Effects of Surface Cleanliness
Surface cleanliness is critical in how a material or a layer on a product interacts with other surfaces, which in turn can affect its functionality.
A Solution for Sensitive Materials – Cryo FIB
Cryo FIB uses a cold sample stage that can be controlled to -135°C making it it more suitable for temperature sensitive materials.
Understanding LA-ICP-MS for Microanalysis
LA-ICP-MS is a technique that uses direct micro-scale sampling to provide high precision elemental characterization of solid materials.
Environmental Stress Cracking of a Polycarbonate Part
A company was investigating environmental stress cracking of polycarbonate components used in a conveyor device that was sanitized.
Evolved Gas Analysis for Material Outgassing Characterization
All materials have trapped gasses inside. Learn how EAG utilizes Evolved Gas Analysis to analyze what gasses are being released.
Utilizing High Depth Resolution for Measuring Layers at an Atomic Level
High Depth Resolution Analysis will play a very important role in the electronic device industry as devices become smaller and smaller.
SIMS Characterization of Atomic Layer Deposition in Electronic Applications
Atomic Layer Deposition technology aids in the demand for computational advancement in the microelectronics industry.
Understanding Lithium-Ion Batteries and Why They Fail
Lithium-ion batteries provide high energy density mobile power but come with three challenges: performance, safety and battery life.
The Importance of VCSELs in Technological Development
VCSELs have several advantages, such as a higher modulation speed, which make them great for technological innovations.
The Birth of PCOR-SIMS for Silicon Germanium (SiGe) Devices
PCOR-SIMS was originally developed to analyze Silicon Germanium (SiGe) devices for the communications industry.
Drive Supply Chain Efficiency with Testing Support from EAG
EAG Laboratories provides clients with answers to these questions and more with testing support for every stage of the supply chain.