
Microscopy Techniques in the Failure Analysis of Optoelectronics
EAG divides FA tasks into three levels. In each level, we employ optimal techniques for device characterization, defect localization, and root cause failure analysis.
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EAG divides FA tasks into three levels. In each level, we employ optimal techniques for device characterization, defect localization, and root cause failure analysis.
To be hermetically sealed essentially means to be airtight so that nothing can come in or get out (i.e., gas, moisture, liquid, etc.).
Our laboratories in France and the Netherlands offer materials testing for industries including semiconductor, consumer electronics, lighting, aerospace and healthcare.
There is still so much to learn about batteries, including challenges such as energy density, cycle life, fast charge, and safety. In this blog, we’ll be focusing on energy density.
XRF is a non-destructive technique that is used to quantify the elemental composition of materials.
FTIR and Raman are spectroscopy techniques that provide molecular information from various types of materials.
As medical devices become more complex, there are many more opportunities for things to go awry. Identifying, diagnosing, and remedying failures becomes dramatically more challenging. We can help.
High reliability electronic components like integrated circuits are often required to operate for long periods of time, having little or no opportunity for replacement.
Besides images provided by SEM and TEM, different attachments can be added to reveal crystalline information, including (SEM-EBSD) and TEM (TEM-PED).
The Dual Beam FIB-SEM integrates a focused ion beam with a scanning electron microscope for simultaneous sample prepping and imaging.
In the aerospace industry, electronics are subjected to extreme environmental variables. EAG’s failure analysis group can help solve potential problems that may arise.
RBS is the one technique where we can really say that the composition and concentration are accurately determined for thin films.
EDS and EELS can be coupled with SEM, STEM and TEM to determine the elemental composition, spatial distribution and segregation of elements.
TEM, STEM and AC-STEM techniques deliver high resolution images providing a detailed view of a material or product.
PFIB differs from traditional FIB in that it uses various gases such as Xe, Ar, oxygen or nitrogen to generate a plasma that is used to remove material from a sample.
One way to combat rising fuel costs in the aerospace industry and improve efficiency is to use new advanced materials such as Ceramic Matrix Composites (CMCs).
In our interconnected and changing world, it is important to know how to respond to potential electronic system failures.
ICP-MS is a multi-elemental bulk chemical analysis technique that can determine simultaneously up to 70 elements in a single sample.
Gallium oxide has the potential to replace or substitute gallium nitride for power conversion in electric trains and vehicles.
Solids fall under two main categories: amorphous and crystalline. These two types of solids have different properties that may be more beneficial for certain products or applications.
EAG scientists are leaders in the lithium-ion batteries recycling arena. EAG is a valuable resource in understanding these materials.
An injection molded component in a consumer product was found to have an increased failure rate over a three-month period.
A client wanted to investigate the delamination of food packaging multilayer laminate. Roll stock did not meet seal strength specification.
The roughness of a surface and how it interacts with surrounding materials and elements can have a significant impact on material technology and its functionality.
FIB Circuit Edit provides the ability to quickly perform nano-surgury by cutting traces or adding metal connections at the chip level
A device manufacturer observed defects in a lot of thermoplastic tubing. The tubing exhibited signs chemical attack or exposure to heating.
Cracks were observed in transparent thermoformed plastic packaging during visual quality checks. Failures occured in specific material lots.
Analytical testing to support changes in raw materials and processing conditions used in manufacturing memory foam, as well as odor
Polymeric films used in an outdoor application experienced reduced adhesion over time. The client suspected that UV degradation was occurring.
EAG Laboratories pursues quality in all aspects of our work for customers. ISO certifications and ongoing audits serves many market sectors.
A client requested assistance to investigate a recurrent issue with the curing failure of a silicone adhesive joint between metal components.
Cryo TEM involves performing TEM analysis while keeping the sample at cryogenic temperatures, around -170°C.
Blisters were observed in paint applied to steel plates that had undergone treatment with a corrosion inhibitor. An investigation was performed to determine if there was evidence of contamination on the inside of the blister.
Televisions, computer screens, cell phone screens etc. are getting clearer, sharper, brighter and use much less power. This is all possible through LEDs.
Aerospace Materials Testing for Tunnel Junction Solar Cells Science has opened many doors in its advancement over the centuries.
Developing a reliable product has many challenges due to the desire for increased capability, reduction in formfactor, and managing the supply chain.
APT is a nanoscale materials analysis technique that provides 3D spatial imaging and chemical composition measurements with high sensitivity simultaneously.
Unwanted chemical impurities can be problematic. GDMS is a powerful full survey analysis tool for chemical purity evaluations.
Different types of SIMS analyses exist. The two main types include Dynamic SIMS (high current) and static-SIMS (low current).
EAG Scientists utilize GDMS analysis to perform Elemental Depth Profiling for chemical purity evaluations for aerospace & defense.
Surface cleanliness is critical in how a material or a layer on a product interacts with other surfaces, which in turn can affect its functionality.
Cryo FIB uses a cold sample stage that can be controlled to -135°C making it it more suitable for temperature sensitive materials.
LA-ICP-MS is a technique that uses direct micro-scale sampling to provide high precision elemental characterization of solid materials.
A company was investigating environmental stress cracking of polycarbonate components used in a conveyor device that was sanitized.
All materials have trapped gasses inside. Learn how EAG utilizes Evolved Gas Analysis to analyze what gasses are being released.
High Depth Resolution Analysis will play a very important role in the electronic device industry as devices become smaller and smaller.
Atomic Layer Deposition technology aids in the demand for computational advancement in the microelectronics industry.
Lithium-ion batteries provide high energy density mobile power but come with three challenges: performance, safety and battery life.
VCSELs have several advantages, such as a higher modulation speed, which make them great for technological innovations.
PCOR-SIMS was originally developed to analyze Silicon Germanium (SiGe) devices for the communications industry.
EAG Laboratories provides clients with answers to these questions and more with testing support for every stage of the supply chain.
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