Warpage Analysis allows for measurement of warpage and deformation of products that are subjected to thermal stresses. This analysis produces a 3D topographical profile. Our new service can help at various steps of a product life cycle, including R&D, process control, design of manufacturing, quality control, and failure analysis.
A coefficient of thermal expansion (CTE) mismatch in a device or PCB can cause deformation during the reflow process or thermal expansion during normal operation, which can cause failures at the interconnects.
Warpage Analyis allows for In-Situ warpage & deformation measurement.