EAG’s failure analysis team comprises a highly technical and professional group of engineers with a wide range of backgrounds and experiences from diverse industries including semiconductor, medical device, aerospace, military, automotive, laser, solar, and manufacturing.
We support innovative companies every day, giving us the unique opportunity to be exposed to cutting-edge technology challenges and advance our expertise for solving them firsthand, including:
- Devices and technology: ASIC, image sensors, discretes, passives, RF, MEMS, MOSFETs, medical device assemblies, PCBs, 3D packages, Advanced CMOS, III-V, GaAs, laser diodes, LEDs, solar cells
- Product life cycle: Design debug, reliability foundry, package assembly, final test yield, field/customer return
- Systems level analysis: Parametric test, PCBA, solder joint integrity, design evaluation
- Construction and competitor analysis
- Counterfeit/authenticity
- Materials analysis: cross sectioning, tear down
- Failure reproduction
- Technical consultation