Scanning Acoustic Microscopy

Scanning acoustic microscopy (SAM) uses sound waves to detect and identify internal delamination, voids, material density changes, defects and many other anomalies within devices, assemblies and materials.

SAM is highly sensitive to the presence of delamination and material density variations, which are difficult to detect using X-ray radiography, Infrared Imaging and other non-destructive techniques. It can detect sub-micron air gaps and has a defect resolution of ~5µm.

EAG offers various imaging modes, allowing the operator to gain the optimal viewing perspective based on the orientation of the feature within the sample. In addition, EAG’s SAM systems incorporate advanced software, hardware features and a wide variety of transducers which allows EAG to provide our customers with the best imaging on the market.


  • Interfacial delamination
  • Joint, bonding, and seal analysis
  • Void detection
  • Crack detection – wafer, die and package level
  • Printed circuit board anomalies
  • Imaging adhesion in films, brazing, soldering, and other interfaces


  • Failure analysis
  • Product reliability
  • IPC / JEDEC J-STD-020 (required for MSL classification)
    • Mil-STD 883, Method 2030, Method 2035
    • NASA, PEM-INST-001
  • Chip Scale Package (CSP) inspection
  • Stacked die imaging
  • Plastic-encapsulated IC inspection
  • Process validation
  • Vendor qualification
  • Product inspection
  • Quality control
  • Research and development
  • Counterfeit detection
FLip Chip bump delamination
Scanning acoustic microscopy, Figure 1

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