Advanced Microscopy of Compound Semiconductors
In this webinar, we will explore the variety of microscopy techniques available at Eurofins EAG commonly utilized to characterize compound semiconductor materials.
Understanding Energy Density in Batteries
There is still so much to learn about batteries, including challenges such as energy density, cycle life, fast charge, and safety. In this blog, we’ll be focusing on energy density.
Dual Beam FIB-SEM: Sample prepping and Imaging
The Dual Beam FIB-SEM integrates a focused ion beam with a scanning electron microscope for simultaneous sample prepping and imaging.
Plasma FIB – A better alternative to traditional FIB?
PFIB differs from traditional FIB in that it uses various gases such as Xe, Ar, oxygen or nitrogen to generate a plasma that is used to remove material from a sample.
FIB Webinar
In this webinar we introduce Advanced Focused Ion Beam (FIB) which provides precise cross-section imaging analysis
FIB Circuit Edit Webinar
In this webinar we introduce FIB Circuit Edit which allows the cutting of connections and placement of new lines in a semiconductor die
Plasma FIB Webinar
In this webinar we introduce Plasma Focused Ion Beam (P-FIB) which is a instrument that combines a SEM with a plasma-based FIB.
Accelerating the Development of Lithium-Ion Batteries
23rd October 2022
Industry Service Labs play a critical role in the battery community by providing fast and professional service. Learn how Eurofins EAG Laboratories can help!
FIB Circuit Edit can help during chip shortages
FIB Circuit Edit provides the ability to quickly perform nano-surgury by cutting traces or adding metal connections at the chip level
When Temperature Matters – Cryo TEM
Cryo TEM involves performing TEM analysis while keeping the sample at cryogenic temperatures, around -170°C.
A Solution for Sensitive Materials – Cryo FIB
Cryo FIB uses a cold sample stage that can be controlled to -135°C making it it more suitable for temperature sensitive materials.
Determining Density of Thin Films
Thin films are widely used in many high-tech devices & consumer products. We discuss the processes used to measure the density of such films.
Which method of sectioning is best for my sample?
Cross sectioning of a semiconductor die is a basic step in failure analysis work. A cross section can be used as a check of layer integrity.
Focused Ion Beam (FIB) Circuit Edit Becomes Increasingly Valuable in High-Stakes World of Advanced Node Design
Focused Ion Beam (FIB) circuit edit techniques and FIB applications to help develop and improve IC design and advanced process nodes
Reducing System Failure Costs in Today’s Digitally Dependent World
Electronic system failure analysis requires expertise in the modes of failures and techniques such as SEM, TEM, and dual-beam FIB.
Advanced Materials and Processes Pose Tough Challenges for Electronic Systems Failure Analysis
Electronic systems failure analysis methodology and workflow by applying FIB circuit edit techniques for solving electronic problems.