
SIMS Analysis of Al and Ga Diffusion
SIMS detects very low concentrations of dopants and impurities. It has been used to study the diffusion of Al and Ga.
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SIMS detects very low concentrations of dopants and impurities. It has been used to study the diffusion of Al and Ga.
To identify and quantify contaminants, utilizing both TXRF and SurfaceSIMS.XP provides surface measurements on semiconductor surfaces.
EAG evaluate corrosion and leaching of nickel-rich implanted medical devices including nitinol, stainless steel and MP35N.
In this webinar we introduce Metal Based Additive Manufacturing Analysis to understand and evaluate many aspects of the metallurgy.
In this webinar we introduce Multiscale Assessment on the Quality of Metal Powder Feedstocks for Additive Manufacturing
In this webinar we introduce analytical techniques used by EAG for surface analysis – XPS, Auger and TOF-SIMS
ICP-MS is a multi-elemental bulk chemical analysis technique that can determine simultaneously up to 70 elements in a single sample.
Cryo FIB uses a cold sample stage that can be controlled to -135°C making it it more suitable for temperature sensitive materials.
Additive manufacturing produces parts with geometric complexity, material composition gradient control, and lightweight structure design.
TGA with hyphenated technologies such as infrared (IR) and/or mass spectrometry (MS) is investigates the outgassing behavior of materials
This paper describes identification of two unknown powders using Raman spectroscopy, combined with two X-ray techniques
Characterizing surface topography is possible with a technique called Optical Profilometry (OP) also known as White Light Interferometry.
Thin films are widely used in many high-tech devices & consumer products. We discuss the processes used to measure the density of such films.
XPS (X-ray photoelectron spectroscopy) is capable of qualitative and quantitative analysis, and it can also determine chemical states.
Complex oxides in energy storage, catalysis, sensor/actuation, optics, epitaxy substrates, electronics, bioceramics, structural ceramics
Characterization of metallurgical failures includes identifying segregation of elemental impurities to the surface of grain boundaries.
The contact lens market has expanded beyond its original goal of vision correction to include products with decorative qualities.
Electrothermal vaporization (ETV) coupled with ICP-OES is an exceptionally sensitive solid sampling technique for purity verifications.
Wavelength Dispersive X-Ray Fluorescence Spectroscopy (WDXRF) is an ideal analytical tool for determining or verifying alloy compositions
Failure analysis metals, nonmetals and composites for aircraft, aerospace, transportation, construction, consumer products, and electronics.
Metallurgical testing lab services from EAG Laboratories includes grain size analysis, Rockwell hardness and image analysis.
Nickel biocompatibility assessments of intravascular stents from EAG includes evaluating corrosion, surfaces and nickel ion release testing.
Laminate failure : Multi-layer laminate by analysis by XPS. Investigation details adhesive failure at a Ni2Mo-Cu interface due to monolayer contamination.
XPS Analysis of Disposable Gloves assesses materials exposed during product manufacturing to make sure contamination is not introduced.
Auger Electron Spectroscopy (AES) is effective in determining the quality of passivation layers to prevent corrosion in medical devices.
Surface Aluminum Characterization highlights advantages of using SurfaceSIMS.XP to determine contamination on processed Si wafers.
SIMS ZnO detection limits of selected elements under normal depth profiling conditions, showing overlay of SIMS profiles of arsenic implant
Impurities adversely affect performance of a CIGS solar cell, with varying concentrations – SIMS can help measure representative sampling.
Medical device corrosion resistance optimized by using Auger depth profile & oxide layer thickness for device surface characterization.
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