SIMS Analysis of Al and Ga Diffusion
SIMS detects very low concentrations of dopants and impurities. It has been used to study the diffusion of Al and Ga.
Characterization of Surface Metallic Contamination
To identify and quantify contaminants, utilizing both TXRF and SurfaceSIMS.XP provides surface measurements on semiconductor surfaces.
Assessing Nickel Leaching on Cardiovascular Stents
EAG evaluate corrosion and leaching of nickel-rich implanted medical devices including nitinol, stainless steel and MP35N.
Metal Additive Manufacturing Analysis Webinar
In this webinar we introduce Metal Based Additive Manufacturing Analysis to understand and evaluate many aspects of the metallurgy.
Quality of Metal Powder Feedstocks for AM Webinar
In this webinar we introduce Multiscale Assessment on the Quality of Metal Powder Feedstocks for Additive Manufacturing
Surface Analysis Webinar
In this webinar we introduce analytical techniques used by EAG for surface analysis – XPS, Auger and TOF-SIMS
Using ICP-MS to Measure Elemental Compositions in Drug Products
ICP-MS is a multi-elemental bulk chemical analysis technique that can determine simultaneously up to 70 elements in a single sample.
A Solution for Sensitive Materials – Cryo FIB
Cryo FIB uses a cold sample stage that can be controlled to -135°C making it it more suitable for temperature sensitive materials.
Multiscale assessment on the quality of metal powder feedstocks for additive manufacturing
Additive manufacturing produces parts with geometric complexity, material composition gradient control, and lightweight structure design.
Evolved Gas Analysis with Thermogravimetric Analysis (TGA-MS)
TGA with hyphenated technologies such as infrared (IR) and/or mass spectrometry (MS) is investigates the outgassing behavior of materials
Identification of Unknown Powders
This paper describes identification of two unknown powders using Raman spectroscopy, combined with two X-ray techniques
Optical Profilometry Roughness Measurements on Machined Parts
Characterizing surface topography is possible with a technique called Optical Profilometry (OP) also known as White Light Interferometry.
Determining Density of Thin Films
Thin films are widely used in many high-tech devices & consumer products. We discuss the processes used to measure the density of such films.
XPS chemical shift and valence
XPS (X-ray photoelectron spectroscopy) is capable of qualitative and quantitative analysis, and it can also determine chemical states.
Optical Emission Spectroscopy for Composition Analysis of Complex Oxides
Complex oxides in energy storage, catalysis, sensor/actuation, optics, epitaxy substrates, electronics, bioceramics, structural ceramics
Fracture Analysis of Metal Grain Boundary Segregation by Auger
Characterization of metallurgical failures includes identifying segregation of elemental impurities to the surface of grain boundaries.
Pigmented contact lenses
The contact lens market has expanded beyond its original goal of vision correction to include products with decorative qualities.
Ultra-Trace Level Contaminants in materials using ETV–ICP–OES
Electrothermal vaporization (ETV) coupled with ICP-OES is an exceptionally sensitive solid sampling technique for purity verifications.
Alloy Characterization using Wavelength Dispersive X-Ray Fluorescence Spectroscopy
Wavelength Dispersive X-Ray Fluorescence Spectroscopy (WDXRF) is an ideal analytical tool for determining or verifying alloy compositions
Failure Analysis of Metals, Nonmetals & Composites
Failure analysis metals, nonmetals and composites for aircraft, aerospace, transportation, construction, consumer products, and electronics.
Metallurgical Testing
Metallurgical testing lab services from EAG Laboratories includes grain size analysis, Rockwell hardness and image analysis.
Assessment of Nickel Exposure Risk of Intravascular Stents and Delivery Systems
Nickel biocompatibility assessments of intravascular stents from EAG includes evaluating corrosion, surfaces and nickel ion release testing.
Cause and Location of Delamination of Multi-layer Metal Foil by XPS
Laminate failure : Multi-layer laminate by analysis by XPS. Investigation details adhesive failure at a Ni2Mo-Cu interface due to monolayer contamination.
XPS Analysis of Disposable Gloves
XPS Analysis of Disposable Gloves assesses materials exposed during product manufacturing to make sure contamination is not introduced.
Stainless Steel Corrosion: Medical Device Applications with Auger
Auger Electron Spectroscopy (AES) is effective in determining the quality of passivation layers to prevent corrosion in medical devices.
Characterization of Surface Aluminum Contamination on Processed Silicon Wafers
Surface Aluminum Characterization highlights advantages of using SurfaceSIMS.XP to determine contamination on processed Si wafers.
SIMS Detection Limits of Selected Elements in ZnO Under Normal Depth Profiling Conditions
SIMS ZnO detection limits of selected elements under normal depth profiling conditions, showing overlay of SIMS profiles of arsenic implant
Sampling of Fe in CIGS, Solar Cell Using Large Area SIMS
Impurities adversely affect performance of a CIGS solar cell, with varying concentrations – SIMS can help measure representative sampling.
Corrosion Resistance Study of Electropolished Medical Devices
Medical device corrosion resistance optimized by using Auger depth profile & oxide layer thickness for device surface characterization.