Auger Electron Spectroscopy applied to electronic circuitry problems involving the integrity of wire or ball bonding to metallic bond pads.
Additive manufacturing produces parts with geometric complexity, material composition gradient control, and lightweight structure design.
Auger (AES) spectra of small defects of various sizes shows excellent sensitivity is maintained down to a defect size of only 20nm.
Characterization of metallurgical failures includes identifying segregation of elemental impurities to the surface of grain boundaries.
Both Auger Electron Spectroscopy (AES) and Energy Dispersive X-ray Spectroscopy (EDX / EDS) are used for elemental analysis.
Auger Identification Interface Contamination is discussed regarding the elimination of contaminants for successful semiconductors.
Auger Electron Spectroscopy (AES) is effective in determining the quality of passivation layers to prevent corrosion in medical devices.
Medical device corrosion resistance optimized by using Auger depth profile & oxide layer thickness for device surface characterization.