Electronic systems failure analysis methodology and workflow by applying FIB circuit edit techniques for solving electronic problems.
During this live Ask the Expert event, we will answer pre-submitted questions from our audience regarding materials analysis with various surface contact and optical analytical techniques.
13th December 2022
Manufacturing Technology Insights recently named EAG Laboratories a Top 10 Corrosion Services Provider. The publication featured an interview with Dana Medlin, our Vice President of Metallurgical Engineering.
25th August 2023
We are thrilled to announce our latest nanoprobing capabilities at EAG, powered by cutting-edge Kleindiek equipment. Nanoprobing is an advanced analytical technique that enables the direct measurement and characterization of front and backend structures.
QFI Instrument Services and electrical localization services from EAG Laboratories are upgraded with LSM and XIVA image.
A company was investigating environmental stress cracking of polycarbonate components used in a conveyor device that was sanitized.
Failure analysis metals, nonmetals and composites for aircraft, aerospace, transportation, construction, consumer products, and electronics.
Failure Analysis and product improvement of metal components is a specialty at EAG Laboratories
EAG Laboratories has the engineering expertise and advanced equipment and tools for microelectronic failure analysis of products and systems.
EAG divides FA tasks into three levels. In each level, we employ optimal techniques for device characterization, defect localization, and root cause failure analysis.
Solving CSP qualification testing challenges by addressing key issues and applying specialized processes through EAG know-how.
The common method of dye & pry can result in the cracking and shattering of die. EAG has altered the common dye & pry method, which has resulted in a significantly improved success rate.
Electronic system failure analysis requires expertise in the modes of failures and techniques such as SEM, TEM, and dual-beam FIB.