Microscopy Techniques in the Failure Analysis of Optoelectronics
EAG divides FA tasks into three levels. In each level, we employ optimal techniques for device characterization, defect localization, and root cause failure analysis.
Failure Analysis of Medical Device Electronics
As medical devices become more complex, there are many more opportunities for things to go awry. Identifying, diagnosing, and remedying failures becomes dramatically more challenging. We can help.
EAG Recognized as a Top 10 Corrosion Services Provider
13th December 2022
Manufacturing Technology Insights recently named EAG Laboratories a Top 10 Corrosion Services Provider. The publication featured an interview with Dana Medlin, our Vice President of Metallurgical Engineering.
Failure Analysis in Aerospace Advancement
In the aerospace industry, electronics are subjected to extreme environmental variables. EAG’s failure analysis group can help solve potential problems that may arise.
Failure Analysis of Reliability Webinar
In this webinar we introduce The Failure Analysis of Reliability Testing Samples as applied electronic and semiconductor devices
Dye & Pry Webinar
In this webinar we introduce Dye and Pry that involves cleaning a sample to remove debris & flux around solder, then exposing it to a red dye.
Electronic Device Failure Analysis Webinar
In this webinar we introduce failure analysis of ICs and other components in the product development cycle and for improving current products
Fractography Webinar
In this webinar we introduce Fractography which is a failure analysis evaluation technique when components fracture
Metallography Webinar
In this webinar we introduce metallography which is a crucial source of valuable information in the failure analysis process
When Innovation Meets Failure Analysis
In our interconnected and changing world, it is important to know how to respond to potential electronic system failures.
Cracking of Molded Components
An injection molded component in a consumer product was found to have an increased failure rate over a three-month period.
Delamination of Food Packaging
A client wanted to investigate the delamination of food packaging multilayer laminate. Roll stock did not meet seal strength specification.
Incompatible Contaminant in Tubing
A device manufacturer observed defects in a lot of thermoplastic tubing. The tubing exhibited signs chemical attack or exposure to heating.
Molded In Stresses
Cracks were observed in transparent thermoformed plastic packaging during visual quality checks. Failures occured in specific material lots.
Off-Odor Memory Foam
Analytical testing to support changes in raw materials and processing conditions used in manufacturing memory foam, as well as odor
Weathering Polymeric Films
Polymeric films used in an outdoor application experienced reduced adhesion over time. The client suspected that UV degradation was occurring.
Curing Issues with Silicone Adhesive
A client requested assistance to investigate a recurrent issue with the curing failure of a silicone adhesive joint between metal components.
Polymer Case Study: Blistering Paint
Blisters were observed in paint applied to steel plates that had undergone treatment with a corrosion inhibitor. An investigation was performed to determine if there was evidence of contamination on the inside of the blister.
Environmental Stress Cracking of a Polycarbonate Part
A company was investigating environmental stress cracking of polycarbonate components used in a conveyor device that was sanitized.
Which method of sectioning is best for my sample?
Cross sectioning of a semiconductor die is a basic step in failure analysis work. A cross section can be used as a check of layer integrity.
Chemical Decapsulation
Chemical Decapsulation: Creation of a cavity on the package surface of an electronic component to expose the die underneath for inspection.
Coatings & Adhesives
EAG’s coatings testing lab provides deformulation, VOC EPA 24 testing, and other ASTM paint evaluations for product improvement and troubleshooting.
LED Analysis
LED characterization, from process control to failure analysis to construction analysis, EAG Laboratories supports your LED analysis needs.
In Vitro Diagnostics Testing
In Vitro Diagnostics test and system development support from the materials sciences experts at EAG Laboratories, contact us today!
Electrical Localization Capabilities using QFI Infrascope
QFI Instrument Services and electrical localization services from EAG Laboratories are upgraded with LSM and XIVA image.
Failure Analysis of Metals, Nonmetals & Composites
Failure analysis metals, nonmetals and composites for aircraft, aerospace, transportation, construction, consumer products, and electronics.
X-Ray Images at EAG
X-ray images from EAG include PCB layers, PC Board views, QFN, PCB Vias, QFP, Flip Chip, 9V Battery, BGA and BGA tilt and rotate.
Time Domain Reflectometry (TDR)
Time Domain Reflectometry (TDR) services from EAG – Each layer in the package may be inspected optically and probed electrically.
Laser Decap at EAG
Laser decap at EAG Laboratories includes our Failure Analysis Laser Inspection Tool, view our picture book of PC boards before and after.
Thermal Mapping at EAG
Temperature measurements of RF transistors to examine temperature distribution and look for areas of heating issues on many types of devices.
Level 1 Failure Analysis
Level 1 Failure Analysis includes: non-destructive tests optical inspection, X-ray, C-SAM, and electrical characterization.
Failure Inspection Post Reliability Stress
Failure inspection during post reliability stress testing to ensure no delamination, voids, cracks, material density changes.
Dye & Pry
Dye and Pry is an excellent way to inspect a large number of bonds (leads, solder ball, seals..) at one time
Failure Analysis of Microelectronic Products and Systems
EAG Laboratories has the engineering expertise and advanced equipment and tools for microelectronic failure analysis of products and systems.
Performing Reliability Qualification Testing On CSP Without Damaging Devices
Solving CSP qualification testing challenges by addressing key issues and applying specialized processes through EAG know-how.
Reducing System Failure Costs in Today’s Digitally Dependent World
Electronic system failure analysis requires expertise in the modes of failures and techniques such as SEM, TEM, and dual-beam FIB.
Advanced Materials and Processes Pose Tough Challenges for Electronic Systems Failure Analysis
Electronic systems failure analysis methodology and workflow by applying FIB circuit edit techniques for solving electronic problems.