
Utilizing High Depth Resolution for Measuring Layers at an Atomic Level
High Depth Resolution Analysis will play a very important role in the electronic device industry as devices become smaller and smaller.
Home » Curing Issues with Silicone Adhesive
Silicone adhesives provide waterproof, flexible bonding that can withstand chemicals and high temperatures. These adhesives are used in the manufacturing of everything from vehicles and airplanes to electronics and consumer products.
A client requested assistance to investigate a recurrent quality issue stemming from failure of a silicone adhesive joint between metal components. An internal investigation uncovered that the cleaning products used in wash and rinse processes of the components had been switched to unapproved formulations; examination of the SDS for these products revealed chemicals known to inhibit cure of silicone adhesives.
A solvent extraction was performed on components that were subjected to the unapproved cleaning process and analyzed by LC-MS, alongside reference specimens of the cleaning products.
A known incompatible chemical from one of the cleaning products was detected on the components, suggesting that residual chemicals from the unapproved cleaning products were causing inhibition of the silicone adhesive curing process.
For more than 50 years, scientists and engineers at Eurofins EAG have investigated and resolved product failures for clients. Our team of experts identify key failure indicators and follow them to the root cause.
Failure analysis of plastics, thermosets, and rubber materials is commonly performed on finished products and typically involve comparative analysis between failed and non-failed samples. Once the potential root cause is identified, experiments can be designed and conducted to test the hypothesis and recreate the failure in the laboratory. Eurofins EAG can evaluate a variety of polymer types, including:
Eurofins EAG Laboratories offers a full suite of analytical techniques to evaluate the identity, composition, morphology, topography, and rheology of polymeric materials and components.
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High Depth Resolution Analysis will play a very important role in the electronic device industry as devices become smaller and smaller.

AC-STEM analysis can provide a visual representation of non-uniformities in an active region. Roughness can easily be observed within interfaces. EDS maps can then be used to corroborate the roughness in relation to composition.

In this webinar we will focus on Rutherford Backscattering Spectrometry (RBS) which is a thin film analysis technique

Supplier verification can be critical to the long-term success of your product and business. At Eurofins EAG, our technical experts have many years of experience working with battery materials. We are your battery partner to bring your product to market faster and more efficiently.
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