Laser decapsulation uses a laser to remove the plastic encapsulant material away from a semiconductor device. Using the laser vaporizes the material instead of the tradition method of dissolving it using chemical.
This can reduce the risk of accidentally destroying the defect with corrosive chemicals. In addition, the system can provide precise decapsulation.
EAG can adjust the removal of epoxy mold compounds keeping the gold, silver, brass, or aluminum bonding wire undamaged silicon, GaAs, InP, and other compound semiconductor dies.
Laser decap at EAG Laboratories includes our Failure Analysis Laser Inspection Tool, view our picture book of PC boards before and after.
Contact us today for your Laser Decap needs at +1 800-366-3867 or please complete the form below to have an EAG expert contact you.
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