Dye & Pry

Dye and Pry involves cleaning a sample to remove debris and flux around solder, then exposing it to a red dye by immersion.  The sample is then exposed to either vacuum or pressure to ensure the dye penetrates into all cracks, separations and surfaces with exposure to the outside of the device.

The parts are then baked in an oven until fully dry. The ink must be fully dried to avoid smearing later.  The device is then separated by prying or flexing of the PCB.  The interfaces now separated are inspected optically.  Failure sites are imaged and identified.

For PQFPs and TSOPs on a PCB the areas of interest are the lead fingers.  The ink gets in where there are cracks in the solder or failure to reflow the solder.  These are areas of weak bonding and likely reliability failures.  The silver colored areas are where the ink was unable to ingress showing good bonding.

Dye and Pry is an excellent way to inspect a large number of bonds (leads, solder ball, seals..) at one time.

Dye and Pry: BGA Dyed
BGA Dyed
Dye and Pry: BGA on PCB as received
BGA on PCB as received
Dye and Pry: BGA Pryed PCB side
BGA Pryed PCB side
Dye and Pry: BGA pryed component side
BGA pryed component side
Dye and Pry: PQFP as received
PQFP as received
Dye and Pry: PQFP dyed
PQFP dyed
Dye and Pry: PQFP pryed device side
PQFP pryed device side
Dye and Pry: PQFP PCB side
Dye and Pry: TSOP on PCB as received
TSOP on PCB as received
Dye and Pry: TSOP dyed
TSOP dyed
Dye and Pry: TSOP PCB side pryed
TSOP PCB side pryed
Dye and Pry: TSOP component side dyed
TSOP component side dyed

Would you like to learn more about Dye & Pry?

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