A Deep Dive into High Powered Electronics
High Powered Electronics are used in a wide suite of applications, from consumer electronics and electric vehicles to railways and power plants and even artificial intelligence.
A materials analysis study into FinFET technology
We provide a materials analysis study into the comparison between 22 nm node and 7 nm node FinFET technologies, using TEM-based techniques.
A Picture is Worth a Thousand Words – TEM, STEM and AC-STEM
TEM, STEM and AC-STEM techniques deliver high resolution images providing a detailed view of a material or product.
A Solution for Sensitive Materials – Cryo FIB
Cryo FIB uses a cold sample stage that can be controlled to -135°C making it it more suitable for temperature sensitive materials.
A TEM-based Materials Analysis Study into 22nm FinFET Technology
A study into the structure, elemental distribution and crystal orientation of a 22nm FinFET using TEM based analysis techniques
Accurate Composition and Quantification of Materials – RBS
RBS is the one technique where we can really say that the composition and concentration are accurately determined for thin films.
Advanced Surface Analysis for Problem-Solving in Flat Panel Display Manufacturing
Advanced Surface Analysis using TOF-SIMS on a flat panel display, discovering residue formed during the manufacturing process.
Advances with Gallium Oxide
Gallium oxide has the potential to replace or substitute gallium nitride for power conversion in electric trains and vehicles.
Amorphous vs. Crystalline Materials
Solids fall under two main categories: amorphous and crystalline. These two types of solids have different properties that may be more beneficial for certain products or applications.
Analysis of GaAs pHEMT & GaN HEMT Webinar
In the full webinar we will focus on the PCOR-SIMS Analysis of GaAs pHEMT and GaN HEMT using Secondary Ion Mass Spectrometry
Analyzing Vertical Cavity Surface Emitting Lasers Webinar
In the full webinar we will introduce analyzing VCSELs with a focus on secondary ion mass spectrometry (SIMS)
Ask the Expert: Elemental Analysis with ICP
June 27, 2024
During this live Ask the Expert event, we will answer pre-submitted questions from our audience regarding Elemental Analysis with Inductively Coupled Plasma (ICP-OES, ICP-MS, LA-ICP-MS). These techniques provide full survey major, minor, trace element analysis, and purity certification for up to 69 measurable elements.
Ask the Expert: Silicon Carbide for High Powered Electronics
February 12, 2025
During this live Ask the Expert event, we will answer pre-submitted questions from our audience regarding Silicon Carbide for High Powered Electronics. EAG Laboratories has a vast depth of experience analyzing silicon carbide using both bulk and spatially resolved analytic techniques and is the world-leading materials characterization and engineering resource for semiconductor testing.
Ask the Expert: Surface Contact and Optical Metrology
During this live Ask the Expert event, we will answer pre-submitted questions from our audience regarding materials analysis with various surface contact and optical analytical techniques.
ATE Test & Engineering Brochure
Our wide range of ATE test equipment and experienced team can support from first silicon debug to release
Atomic Layer Deposition (ALD) Analysis
Atomic layer deposition analysis helps you meet ALD specifications for composition, thickness, and crystallinity.
Atomic Layer Deposition (ALD) Analysis Brochure
EAG has the timely accurate measurements and information you need to work with analysis of Atomic Layer Deposition thin films
Benefits of Image Processing
Image processing can be used to generate high density critical dimension measurements that allow us to extract the full profile of the interfacial roughness in a multilayer stack.
Characterization & Failure Analysis of Optoelectronics Webinar
In the full webinar we introduce Characterization and Failure Analysis of Optoelectronic Materials and Devices
Characterization of Crystalline structures – SEM-EBSD vs TEM-PED
Besides images provided by SEM and TEM, different attachments can be added to reveal crystalline information, including (SEM-EBSD) and TEM (TEM-PED).
Component Product Qualification Webinar
In this webinar we introduce Microelectronic Component Product Qualification to understand and consider component reliability.
Determine Electrical Properties Using Electrical AFM
Electrical AFM can measure the electrical/electromechanical properties of various functional materials and samples. This helps distinguish between conductive and nonconductive areas or polar and nonpolar regions of a device.
Dual Beam FIB-SEM: Sample prepping and Imaging
The Dual Beam FIB-SEM integrates a focused ion beam with a scanning electron microscope for simultaneous sample prepping and imaging.
Dye & Pry Webinar
In this webinar we introduce Dye and Pry that involves cleaning a sample to remove debris & flux around solder, then exposing it to a red dye.
EAG assists Global Semiconductor Alliance Incubation team
19th December 2019
EAG Laboratories is proud to help the Global Semiconductor Alliance incubation team assist semiconductor startups
Effects of Surface Roughness
The roughness of a surface and how it interacts with surrounding materials and elements can have a significant impact on material technology and its functionality.
Elemental Composition using XRF
XRF is a non-destructive technique that is used to quantify the elemental composition of materials.
Evaluating Electropolished Stainless Steel for Gas Distribution
Evaluating Surface and Oxide Composition of Electropolished Stainless Steel for High-Purity Gas Distribution Systems
Evolved Gas Analysis for Material Outgassing Characterization
All materials have trapped gasses inside. Learn how EAG utilizes Evolved Gas Analysis to analyze what gasses are being released.
Failure Analysis in a Complex World Webinar
In this webinar we show how EAG troubleshoots electronic system failures using a multidisciplinary approach
Failure Analysis of ICs and Components Brochure
Expert failure analysis will shorten development cycles.
Failure Analysis of Reliability Webinar
In this webinar we introduce The Failure Analysis of Reliability Testing Samples as applied electronic and semiconductor devices
FIB Circuit Edit & Debug Brochure
Speed up your product development cycle with quick and easy FIB edits
FIB Circuit Edit can help during chip shortages
FIB Circuit Edit provides the ability to quickly perform nano-surgury by cutting traces or adding metal connections at the chip level
FIB Circuit Edit Webinar
In this webinar we introduce FIB Circuit Edit which allows the cutting of connections and placement of new lines in a semiconductor die
From Certifications To Customer Audits, Quality Matters
EAG Laboratories pursues quality in all aspects of our work for customers. ISO certifications and ongoing audits serves many market sectors.
FTIR and Raman – Composition and Contamination Analysis
FTIR and Raman are spectroscopy techniques that provide molecular information from various types of materials.
High Detection Sensitivity at the Nanoscale Level – APT
APT is a nanoscale materials analysis technique that provides 3D spatial imaging and chemical composition measurements with high sensitivity simultaneously.
Interface and Abruptness Characterization of Si/SiGe Superlattice Epitaxial Films
The process of applying both PCOR-SIMSSM and STEM imaging to the same Si-SiGe multilayer sample demonstrates the individual strengths of both techniques and how they can be combined to form a complete understanding of the sample.
Is my surface clean? Effects of Surface Cleanliness
Surface cleanliness is critical in how a material or a layer on a product interacts with other surfaces, which in turn can affect its functionality.
LED Analysis
LED characterization, from process control to failure analysis to construction analysis, EAG Laboratories supports your LED analysis needs.
Lithium Ore and Concentrates for Battery Production and Beyond
Eurofins EAG Laboratories stands ready to assist in the analysis of lithium-ion batteries from the raw material supply chain through to the finished product and eventual recycling.
Materials Characterization for a Semiconductor Testing Customer
EAG’s material and microelectronic testing service is dedicated to providing the best information from ensuring the purity of starting materials, to prototype testing of devices in the ramp up towards full-scale production.
MicroLED Analysis Webinar
In the full webinar we introduce MicroLED Analysis for improved understanding of III-nitride material properties and growth/device processes
Microscopy Techniques in the Failure Analysis of Optoelectronics
EAG divides FA tasks into three levels. In each level, we employ optimal techniques for device characterization, defect localization, and root cause failure analysis.
Performing Reliability Qualification Testing On CSP Without Damaging Devices
Solving CSP qualification testing challenges by addressing key issues and applying specialized processes through EAG know-how.
Plasma FIB – A better alternative to traditional FIB?
PFIB differs from traditional FIB in that it uses various gases such as Xe, Ar, oxygen or nitrogen to generate a plasma that is used to remove material from a sample.
Rare Earth Elements Aren’t So Rare After All
The term ‘rare earth elements’ (REEs) is a misnomer and better refers to the relatively rare ores REEs are extracted from; rare earth elements are all around us!
Semiconductor Innovation Brochure
We help technology innovators translate ideas into realities, improve processes and products, and protect their brands
Semiconductor Stress Measurements by Raman Spectroscopy
Semiconductor stress measurements by Raman Spectroscopy helps control problems related to stress control in semiconductor devices, from EAG.
Silicon Carbide – A Powerful Semiconductor for the Future
Silicon carbide is increasingly considered a potential replacement for traditional silicon semiconductors due to its superior properties.
SIMS Characterization of Atomic Layer Deposition in Electronic Applications
Atomic Layer Deposition technology aids in the demand for computational advancement in the microelectronics industry.
Statistical Analysis of Multilayer Structures in Electron Microscopy Using Image Processing
In this application note, we demonstrate our capability to generate a large number of measurements in a single image to determine the roughness of interfaces in a multilayer stack and the roughness correlation across layers.
Technology Law
Technology law covers the use of technology and covers all of the ways that devices and methods of communication impact society.
Testing for technology innovators
Through multidisciplinary science and engineering, EAG helps companies translate ideas into technology by supporting R&D, NPI and production.
Testing of High Speed I/O Webinar
In this webinar we introduce the Testing of High Speed I/O to validate the devices from characterization to production
The Birth of PCOR-SIMS for Silicon Germanium (SiGe) Devices
PCOR-SIMS was originally developed to analyze Silicon Germanium (SiGe) devices for the communications industry.
The Crucial Role of Warpage Analysis
Warpage Analysis serves as a valuable tool for measuring the warpage and deformation experienced by products under thermal stresses.
The Importance of VCSELs in Technological Development
VCSELs have several advantages, such as a higher modulation speed, which make them great for technological innovations.
Thin Film Analysis Webinar
In the full webinar we will discuss Thin Film Analysis that looks at film composition, thickness, and uniformity.
Understanding LA-ICP-MS for Microanalysis
LA-ICP-MS is a technique that uses direct micro-scale sampling to provide high precision elemental characterization of solid materials.
Unlocking the Power of Automated Test Equipment (ATE) and Customized Solutions
Automated Test Equipment (ATE) systems are carefully designed to test a wide range of semiconductor devices. EAG provides tailored ATE test solutions to meet the unique needs of clients.
Using SIMS to Scrutinize HEMTs
HEMTs characterization using SIMS helps to uncover troublesome impurities, optimize epitaxial layer growth and aid failure analysis
Utilizing High Depth Resolution for Measuring Layers at an Atomic Level
High Depth Resolution Analysis will play a very important role in the electronic device industry as devices become smaller and smaller.
When Images Aren’t Enough – EDS and EELS
EDS and EELS can be coupled with SEM, STEM and TEM to determine the elemental composition, spatial distribution and segregation of elements.
When Innovation Meets Failure Analysis
In our interconnected and changing world, it is important to know how to respond to potential electronic system failures.