TEM, STEM and AC-STEM techniques deliver high resolution images providing a detailed view of a material or product.
A study into the structure, elemental distribution and crystal orientation of a 22nm FinFET using TEM based analysis techniques
RBS is the one technique where we can really say that the composition and concentration are accurately determined for thin films.
Advanced Surface Analysis using TOF-SIMS on a flat panel display, discovering residue formed during the manufacturing process.
In the full webinar we will introduce analyzing VCSELs with a focus on secondary ion mass spectrometry (SIMS)
During this live Ask the Expert event, we will answer pre-submitted questions from our audience regarding materials analysis with various surface contact and optical analytical techniques.
In the full webinar we introduce Characterization and Failure Analysis of Optoelectronic Materials and Devices
Besides images provided by SEM and TEM, different attachments can be added to reveal crystalline information, including (SEM-EBSD) and TEM (TEM-PED).
19th December 2019
EAG Laboratories is proud to help the Global Semiconductor Alliance incubation team assist semiconductor startups
Evaluating Surface and Oxide Composition of Electropolished Stainless Steel for High-Purity Gas Distribution Systems
All materials have trapped gasses inside. Learn how EAG utilizes Evolved Gas Analysis to analyze what gasses are being released.
EAG Laboratories pursues quality in all aspects of our work for customers. ISO certifications and ongoing audits serves many market sectors.
FTIR and Raman are spectroscopy techniques that provide molecular information from various types of materials.
APT is a nanoscale materials analysis technique that provides 3D spatial imaging and chemical composition measurements with high sensitivity simultaneously.
Surface cleanliness is critical in how a material or a layer on a product interacts with other surfaces, which in turn can affect its functionality.
Eurofins EAG Laboratories stands ready to assist in the analysis of lithium-ion batteries from the raw material supply chain through to the finished product and eventual recycling.
EAG’s material and microelectronic testing service is dedicated to providing the best information from ensuring the purity of starting materials, to prototype testing of devices in the ramp up towards full-scale production.
EAG divides FA tasks into three levels. In each level, we employ optimal techniques for device characterization, defect localization, and root cause failure analysis.
Solving CSP qualification testing challenges by addressing key issues and applying specialized processes through EAG know-how.
PFIB differs from traditional FIB in that it uses various gases such as Xe, Ar, oxygen or nitrogen to generate a plasma that is used to remove material from a sample.
Semiconductor stress measurements by Raman Spectroscopy helps control problems related to stress control in semiconductor devices, from EAG.
Silicon carbide is increasingly considered a potential replacement for traditional silicon semiconductors due to its superior properties.
Atomic Layer Deposition technology aids in the demand for computational advancement in the microelectronics industry.
In this application note, we demonstrate our capability to generate a large number of measurements in a single image to determine the roughness of interfaces in a multilayer stack and the roughness correlation across layers.
PCOR-SIMS was originally developed to analyze Silicon Germanium (SiGe) devices for the communications industry.
VCSELs have several advantages, such as a higher modulation speed, which make them great for technological innovations.
Automated Test Equipment (ATE) systems are carefully designed to test a wide range of semiconductor devices. EAG provides tailored ATE test solutions to meet the unique needs of clients.
High Depth Resolution Analysis will play a very important role in the electronic device industry as devices become smaller and smaller.