Characterization and Failure Analysis of Optoelectronic Webinar

In the full webinar we introduce Characterization and Failure Analysis of Optoelectronic Materials and Devices.

The success of modern compound semiconductor optoelectronic devices relies on the innovation and optimization of both materials engineering and device topologies. Devices such as LEDs and lasers have to handle very high power densities, often having emission areas on the order of mm^2, while only a very small portion of the overall structure, several 10’s of nms in thickness, is responsible for all the light generation. Thus, the elimination of inherent reliability issues requires an ability to characterize the structure and properties of these devices across a wide variety of length scales. This is accomplished through an integrated multi-technique approach with non-destructive testing methods for bulk characterization and defect isolation leading to further highly localized destructive techniques for root cause determination.

In this webinar we will cover:

  • The common tools and techniques for
    • Non-destructive defect localization and bulk materials characterization
    • Destructive techniques for defect analysis and root cause determination
  • Real world examples of how we can utilize them for both research and development needs as well as for highly localized Failure Analysis.

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