Li-Ion electrodes are more than just energy suppliers; they’re intricate mazes of structures and materials. Their design and intricate layout play pivotal roles in determining a battery’s capacity, discharge rate, and overall lifespan.
It’s cool to know that some of the analytical techniques available at EAG, such as SEM and XRD, are being used to analyze a sample from space! How awesome is that?
23rd October 2022
Industry Service Labs play a critical role in the battery community by providing fast and professional service. Learn how Eurofins EAG Laboratories can help!
In this webinar, we will explore the variety of microscopy techniques available at Eurofins EAG commonly utilized to characterize compound semiconductor materials.
CIGS Thin Film PV performance reliability and uniformity as manufacturing is scaled up, can be optimized using materials characterization.
Battery materials characterization services includes analysis of raw materials, surface chemistry, composition, morphology and uniformity
Biomedical Morphology and Microstructure through imaging analysis – characterizing crystallographic phase and producing elemental maps.
SEM-Cathodoluminescence is used for a wide variety of luminescent materials and devices. It allows for the inspection of optical properties with sub-um spatial resolutions combined with SEM imaging having 3-5nm spatial resolution.
Besides images provided by SEM and TEM, different attachments can be added to reveal crystalline information, including (SEM-EBSD) and TEM (TEM-PED).
A discussion of EAG’s elemental characterization of defects and contamination on surfaces for failure analysis through EDS, SEM and AES.
Cryogenic focused ion beam and scanning electron microscopy is a technique used to reduce damage caused by ion and electron beams.
The Dual Beam FIB-SEM integrates a focused ion beam with a scanning electron microscope for simultaneous sample prepping and imaging.
In this webinar we introduce Energy Dispersive X-ray Spectroscopy (EDS) and Electron Energy Loss Spectroscopy (EELS)
The roughness of a surface and how it interacts with surrounding materials and elements can have a significant impact on material technology and its functionality.
In the aerospace industry, electronics are subjected to extreme environmental variables. EAG’s failure analysis group can help solve potential problems that may arise.
Food packaging materials can be made with plastics, paper and board, glass, metal, wax, and printing inks. These packaging materials are directly and indirectly in contact with our food.
Application of SIMS, XPS/ESCA, SEM and ICP-MS to test for appearance of glass lamellae in parenteral pharmaceutical solutions, by EAG
SEM-EDS and RAMAN analytical testing laboratory techniques applied to identification of foreign material contamination on pharmaceuticals.
In Vitro Diagnostics test and system development support from the materials sciences experts at EAG Laboratories, contact us today!
Surface cleanliness is critical in how a material or a layer on a product interacts with other surfaces, which in turn can affect its functionality.
LED characterization, from process control to failure analysis to construction analysis, EAG Laboratories supports your LED analysis needs.
EAG divides FA tasks into three levels. In each level, we employ optimal techniques for device characterization, defect localization, and root cause failure analysis.
6th September 2019
Morphology and Particle Analysis measures particle size and shape along with particle chemistry, for high throughput elemental analysis.
Additive manufacturing produces parts with geometric complexity, material composition gradient control, and lightweight structure design.
PFIB differs from traditional FIB in that it uses various gases such as Xe, Ar, oxygen or nitrogen to generate a plasma that is used to remove material from a sample.
15th September 2023
EAG Laboratories is pleased to announce a new addition to our wide range of Advanced Microscopy techniques. We now offer Plasma FIB (PFIB) services!
Electronic system failure analysis requires expertise in the modes of failures and techniques such as SEM, TEM, and dual-beam FIB.
When information is required from a compound seminconductor, EAG can depackage and deprocess the sample, & fully characterize it.
SEM coupled with EDS provides high-resolution and high-depth-of-field images of
the sample surface along with elemental identification.
In this webinar we will focus on SEM Cathodoluminescence (SEM-CL) Analyses for Materials such as compound semiconductors
In this webinar we will focus on Energy Dispersive X-ray Spectroscopy (EDS) and Scanning Electron Microscopy (SEM)
Silicon carbide is increasingly considered a potential replacement for traditional silicon semiconductors due to its superior properties.
Structural and Chemical Characterization of Li-ion Batteries help to understand why batteries fail leading to safer products and improvements.
Supplier verification can be critical to the long-term success of your product and business. At Eurofins EAG, our technical experts have many years of experience working with battery materials. We are your battery partner to bring your product to market faster and more efficiently.
Surface analysis lab techniques on α-Si thin film PV, microcrystalline Si, nanocrystalline Si, amorphous SiGe, & microcrystalline SiC
Analytical tools to understand chemical properties of polymers for adhesion, printability, barrier performance, appearance and strength
Contamination control and defect reduction are critical issues in the manufacturing process of compound semiconductor devices which can impact the performance of the end product. We can provide valuable insights to identify contaminants and characterize materials throughout the product lifecycle.
Paint deformulation separates out components to be identified with the normal analytical techniques available to the chemist.
SEM equipped with EDS can capture detailed images and identify elements simultaneously on the surface of samples.
There is still so much to learn about batteries, including challenges such as energy density, cycle life, fast charge, and safety. In this blog, we’ll be focusing on energy density.
EDS and EELS can be coupled with SEM, STEM and TEM to determine the elemental composition, spatial distribution and segregation of elements.
Cross sectioning of a semiconductor die is a basic step in failure analysis work. A cross section can be used as a check of layer integrity.
We investigate why Toothbrush bristles may begin to feel hard, stiff and rigid when compared to an unused toothbrush.
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