
Advanced Microscopy of Compound Semiconductors
In this webinar, we will explore the variety of microscopy techniques available at Eurofins EAG commonly utilized to characterize compound semiconductor materials.
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In this webinar, we will explore the variety of microscopy techniques available at Eurofins EAG commonly utilized to characterize compound semiconductor materials.
EAG divides FA tasks into three levels. In each level, we employ optimal techniques for device characterization, defect localization, and root cause failure analysis.
There is still so much to learn about batteries, including challenges such as energy density, cycle life, fast charge, and safety. In this blog, we’ll be focusing on energy density.
Besides images provided by SEM and TEM, different attachments can be added to reveal crystalline information, including (SEM-EBSD) and TEM (TEM-PED).
The Dual Beam FIB-SEM integrates a focused ion beam with a scanning electron microscope for simultaneous sample prepping and imaging.
In the aerospace industry, electronics are subjected to extreme environmental variables. EAG’s failure analysis group can help solve potential problems that may arise.
EDS and EELS can be coupled with SEM, STEM and TEM to determine the elemental composition, spatial distribution and segregation of elements.
PFIB differs from traditional FIB in that it uses various gases such as Xe, Ar, oxygen or nitrogen to generate a plasma that is used to remove material from a sample.
In this webinar we introduce Energy Dispersive X-ray Spectroscopy (EDS) and Electron Energy Loss Spectroscopy (EELS)
In this webinar we will focus on SEM Cathodoluminescence (SEM-CL) Analyses for Materials such as compound semiconductors
In this webinar we will focus on Energy Dispersive X-ray Spectroscopy (EDS) and Scanning Electron Microscopy (SEM)
23rd October 2022
Industry Service Labs play a critical role in the battery community by providing fast and professional service. Learn how Eurofins EAG Laboratories can help!
The roughness of a surface and how it interacts with surrounding materials and elements can have a significant impact on material technology and its functionality.
Surface cleanliness is critical in how a material or a layer on a product interacts with other surfaces, which in turn can affect its functionality.
Additive manufacturing produces parts with geometric complexity, material composition gradient control, and lightweight structure design.
We investigate why Toothbrush bristles may begin to feel hard, stiff and rigid when compared to an unused toothbrush.
Cross sectioning of a semiconductor die is a basic step in failure analysis work. A cross section can be used as a check of layer integrity.
6th September 2019
Morphology and Particle Analysis measures particle size and shape along with particle chemistry, for high throughput elemental analysis.
LED characterization, from process control to failure analysis to construction analysis, EAG Laboratories supports your LED analysis needs.
In Vitro Diagnostics test and system development support from the materials sciences experts at EAG Laboratories, contact us today!
Biomedical Morphology and Microstructure through imaging analysis – characterizing crystallographic phase and producing elemental maps.
Paint deformulation separates out components to be identified with the normal analytical techniques available to the chemist.
Structural and Chemical Characterization of Li-ion Batteries help to understand why batteries fail leading to safer products and improvements.
Battery materials characterization services includes analysis of raw materials, surface chemistry, composition, morphology and uniformity
Analytical tools to understand chemical properties of polymers for adhesion, printability, barrier performance, appearance and strength
Surface analysis lab techniques on α-Si thin film PV, microcrystalline Si, nanocrystalline Si, amorphous SiGe, & microcrystalline SiC
CIGS Thin Film PV performance reliability and uniformity as manufacturing is scaled up, can be optimized using materials characterization.
SEM-EDS and RAMAN analytical testing laboratory techniques applied to identification of foreign material contamination on pharmaceuticals.
When information is required from a compound seminconductor, EAG can depackage and deprocess the sample, & fully characterize it.
Electronic system failure analysis requires expertise in the modes of failures and techniques such as SEM, TEM, and dual-beam FIB.
Application of SIMS, XPS/ESCA, SEM and ICP-MS to test for appearance of glass lamellae in parenteral pharmaceutical solutions, by EAG
A discussion of EAG’s elemental characterization of defects and contamination on surfaces for failure analysis through EDS, SEM and AES.
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