Recent years, with the functional cell getting smaller and smaller in semiconductor material sciences, high quality failure analysis techniques have become more and more critical. Advanced focused ion beam – scanning electron microscopy (FIB-SEM) techniques could provide precise cross-section imaging analysis as well as high quality TEM sample preparation. Moreover, functional parts such as Cryo stage, iFast based software have been developed to fit the needs of various kinds of materials and structures that are difficult to be analyzed under normal condition.
In this webinar, we will be discussing the FIB-SEM methods for cross-section imaging failure analysis and TEM sample preparation, including the basic principle, applications, and advanced functional parts. Cryo stage FIB, Auto mapping and Auto Slice & View – 3D reconstruction will be emphasized.
In this webinar we will cover:
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