Residual Gas Analysis for Hermetically Sealed Devices
To be hermetically sealed essentially means to be airtight so that nothing can come in or get out (i.e., gas, moisture, liquid, etc.).
Increase the Reliability of Products in the Field with DPA
Long-Term Reliability for Electronic Components
High reliability electronic components like integrated circuits are often required to operate for long periods of time, having little or no opportunity for replacement.
The long-term reliability of these components is especially important to the defense, aerospace, and automotive industries.
Destructive Physical Analysis (DPA)
Destructive Physical Analysis (DPA) is a systematic detailed examination of components during various stages of physical disassembly. Parts are examined for a wide variety of design, workmanship, and processing problems that may not show up during normal screening tests.
DPA test is routinely used by the aerospace industry to qualify electronic components. More and more commercial applications are using DPA screening to dramatically increase the reliability of their products in the field.
More Than 50 Years of DPA experience
Eurofins EAG Laboratories (formerly SEAL Laboratories) has been performing Destructive Physical Analysis (DPA) since 1972 on materials used in aerospace, commercial, military, and government applications.
With more than a half century of experience performing Destructive Physical Analysis, we can test your product for all standards.
• Integrated circuits
• Transistors
• Diodes
• Capacitors
• Resistors
• Relays
• Fuses
• Temperature sensors
• Filters, crystals
• Transformers, inductors, coils
• RF devices, microwave components
• Connectors, switches
• Hybrids containing multi-components
Our facilities are complete and DLA certified for Residual Gas Analysis/Internal Water Vapor (RGA), Particle Impact Noise Detection (PIND) X-Ray Radiography and SEM Inspection. Additional testing capabilities include External Visual Inspection, Hermetic Seal Testing (Fine Leak, Gross Leak), Delid/Decap/Case Removal, Internal Visual Inspection, Bond Pull Strength, Die Shear, SEM Inspection and Microsectioningelec.
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