EAG Laboratories is a world leader in failure analysis services. We support customers by investigating the root cause of a material failure, and can act as an expert witness in a legal investigation to determine who is at fault in a liability case. From raw materials to the end product, we offer a comprehensive suite of testing techniques to determine a materials failure.
Failure analysis uses data to determine the root cause of a failure using various analytical techniques. Firstly, the investigation typically involves testing failed components to determine the area of the breakage. Secondly, further analysis is used to identify potential reason for the failure to occur. Nondestructive testing methods are sometimes utilized at the early stages of a failure investigation to allow for more tests to be made on a material.
Failure Analysis requires the right combination of tools, methodology, and experience to understand the problem, and identify the failure mechanism. EAG Laboratories has several hundred highly educated and experienced employees working on 2,500 instruments in 22 laboratories around the world. Our integrated model supports companies during the complete product lifecycle from conception to volume production in a IP Secured environment.
The following are just a few of our services that can help you understand the root cause of your failure.
Providing failure analysis services for the electronics industry for devices such as ASIC, image sensors, discretes, passives, RF, MEMS, MOSFETs, medical device assemblies, PCBs, 3D packages, Advanced CMOS, III-V, GaAs, laser diodes, LEDs, and solar cells.
Failure and product improvement of metal components in industries such as aircraft, aerospace, transportation, construction, consumer products, electronics, hostile service environments, energy production, structural components and medical devices.
Contact us today for your complete range of Failure Analysis services needs at +1 800-366-3867 or please complete the form below to have an EAG expert contact you.
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