Solderability Testing at Eurofins EAG: Ensure Long-term Performance and Reliability
As electronic assemblies become more complex, ensuring high quality solder joints is critical for long term performance and reliability. Poor solderability can lead to defects such as weak bonds, voids, or non-wetting, resulting in assembly and premature field failures. At EAG Laboratories, our solderability testing provides quantitative, data driven assessments of component and PCB surface solderability in compliance with MIL-STD, J-STD-002, and IPC standards. Our testing helps manufacturers and customers to validate materials, optimize processes, and reduce risk in high reliability applications.
Advantage
EAG solderability testing, centered around the wetting balance analysis, delivers precise, repeatable measurements of solderability performance, supporting and validating the subjective visual inspections often found in more common testing procedures.
Wetting force (mN) is measured to show the strength of solder adhesion. Time to wetting identifies slow or incomplete wetting issues, while meniscus curve analysis evaluates solder interaction with surfaces over time. This repeatable testing allows for increased valuable data that can be used for root cause analysis on solder joint defects. This data can also be utilized for process optimization, by validating flux activity, surface finishes and storage conditions.
Additionally with high sensitivity to marginal defects, EAG is able to help detect early-stage oxidation, contamination, or poor surface finishes before assembly failures occur. Measuring wetting speed helps identify slow wetting issues, which go unnoticed in standard visual checks.
Preconditioning through Steam aging and reflow/oven aging allows moisture induced failures and solderability degradation to be tested. Simply put, EAG transforms solderability testing from pass/fail inspection to predictive quality assurance and fault analysis.
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