EAG Laboratories proudly announces the launch of a new laboratory in China dedicated to improving materials, products and electronics. Newly built in Shanghai, this facility brings the most advanced imaging and surface analysis expertise and technology to China, providing manufacturers with direct access to scientific expertise in the analysis of physical structures, chemical properties and composition of materials.
The new lab offers advanced microscopy capabilities in TEM (FEI Themis Z) and Dual Beam FIB (Helios G4 HX & UC FIBs). For supporting advanced R&D, the Themis Z aberration corrected TEM is capable of ultra-high energy resolution and ultra-high sub-atomic spatial resolution for imaging and chemistry (EDS & EELS).
These state-of-the art tools, along with EAG’s specialized team of highly trained and qualified staff can apply these techniques to the most complex investigations involving materials and electronic products.
EAG Laboratories strives to maintain the highest quality standards in delivering technically superior analysis, with well trained and qualified personnel using the most advanced Instruments. Additional techniques available through our new facility and network include GDMS, RBS/HFS, TXRF, XRD/XRR, AES, SEM, EDX, and more.
RBS is the one technique where we can really say that the composition and concentration are accurately determined for thin films.
TEM, STEM and AC-STEM techniques deliver high resolution images providing a detailed view of a material or product.
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