Women in STEM Industry Fair
Women in STEM Career Fair Eurofins EAG Laboratories is excited to host a Women in STEM Career Fair on March 31st from 3 PM – 6 PM ET! We’re looking
Eurofins EAG Expands ATE Capabilities with Teradyne UltraFLEXplus
Eurofins EAG Laboratories has added the Teradyne UltraFLEXplus to its suite of advanced automated test equipment (ATE), enhancing its ability to support high-performance semiconductor testing. The UltraFLEXplus combines new instrument and software capabilities with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s long history.
Advantages:
- Faster Time to Production: IG-XL software compatibility and the new Broadside Applications Interface enables test engineers to be more productive from the start and reduce the time to production by more than 20%.
- Higher Throughput: The new UltraFLEXplus architecture increases site counts and improves parallel test efficiency, increasing overall throughput and reducing the number of test cells required by 15%-50%.
- Flexible and Scalable: The UltraFLEXplus can be redeployed for multiple product lines and upgraded for future product requirements, increasing reuse and extending the asset’s useful life.
Common Applications
- Cloud and Edge Artificial Intelligence Processors
- Mobile Application Processor
- Digital Baseband Processors
- High Data Rate RF Transceivers
- RF Connectivity Devices
- mmWave
- 5G
- Mobile Power Management ICs (PMIC)
- Microprocessors
- Network Processors
- High Speed SERDES (SERializer/DESerializer) and Backplane Transceivers
- Storage Controllers
- High-end Microcontrollers
- Audio and Video Processors
UltraFLEXplus Training
EAG provides UltraFLEXplus training to our customers at our Santa Clara facility
About Eurofins EAG Laboratories ATE Test and Engineering
Eurofins EAG Laboratories provides flexible, end-to-end ATE test solutions to support every stage of your product lifecycle—from first silicon debug to high-volume production. Our experienced team and advanced equipment enable reliable testing for digital and RF devices, both at wafer and packaged levels. We offer around-the-clock support, a large skilled team, and a fully equipped test floor with probers, handlers, and temperature forcing systems. Whether you need targeted engineering help or a full turnkey solution, we help you reduce risk, speed up development, and scale with confidence.
For more information, please visit our websites:
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