Chemical Decapsulation: Creation of a cavity on the package surface of an electronic component such as a DIP, BGA, QFN or other types of packages to expose the die underneath for inspection. This can be achieved by using a chemical etcher or by creating a shallow cavity on the package surface with a laser etcher and manually dropping acid on the package over a hot plate.
Normal Decap with Gold Wires
Normal Decap with Copper Wires
Decap with the Lead Fingers Exposed
Note: Laser is used to expose the lead fingers after the die is exposed by acid.
Non-ideal Decap Results
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