Chemical Decapsulation

Chemical Decapsulation: Creation of a cavity on the package surface of an electronic component such as a DIP, BGA, QFN or other types of packages to expose the die underneath for inspection. This can be achieved by using a chemical etcher or by creating a shallow cavity on the package surface with a laser etcher and manually dropping acid on the package over a hot plate.

Normal Decap with Gold Wires

Die with gold bond wires exposed
Die with gold bond wires exposed
Close up of intact aluminum pads
Close up of intact aluminum pads

Normal Decap with Copper Wires

Die with copper wires exposed
Die with copper wires exposed
Close up of intact aluminum pads
Close up of intact aluminum pads

Decap with the Lead Fingers Exposed

Die with lead fingers exposed
Die with lead fingers exposed
Close up of exposed lead fingers
Close up of exposed lead fingers

Note: Laser is used to expose the lead fingers after the die is exposed by acid.

Non-ideal Decap Results

Discolored aluminum pads
Discolored aluminum pads
Over-etched aluminum pads
Over-etched aluminum pads

 

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