Failure Analysis of ICs and Components

As products and technologies become more complex, failure analysis of ICs and other components plays a critical role in the product development cycle and for improving current products. EAG has the engineering expertise coupled with a significant investment in advanced failure analysis tools and equipment to help you solve your most complex issues. We can provide the best analysis techniques and expertise to lead investigations for a wide range of samples, technology disciplines and industries, for example:

  • Devices and technology: ASIC, image sensors, discretes, passives, RF, advanced CMOS, III-V, 3D packages, LED, laser diodes, solar cells
  • Product life cycle: design debug, foundry, package assembly, final test yield, field / customer return
  • Systems level analysis: parametric test, PCBA, solder joint integrity, technical consultation
  • Construction and competitor analysis
  • Counterfeit / authenticity
  • Materials analysis, cross sectioning, teardown
  • Technical consultation


EAG Laboratories provides the specialized support and services you need to accelerate time to market, fill equipment and expertise gaps, and manage risk associated with product development.

  • Expertise in failure analysis of ICs with advanced product technologies
  • Comprehensive services from technique specific to turnkey and root cause support
  • Wide range of equipment for inspection, analysis, and fault isolation of complex projects
  • Customized services to meet your specific needs


The ultimate goal in failure analysis is to arrive at an accurate determination of the cause of the failure. EAG has a proven, methodical process of failure analysis that is efficient but can be customized for your needs. For all levels of effort, EAG uses advanced tools and techniques coupled with expert interpretation to provide insight into the investigation and product failure.


This is a focused approach designed to include one or more specific analysis techniques to understand, characterize or determine a defined task/need.


Perform defined and established scope of analysis, which may include failure verification, non-destructive package integrity examination, visual inspection, fault isolation and physical identification and characterization of the failure mechanism.


Lead a complex project to determine root cause of a failure, define corrective actions, design/product validation or improvements and other advanced engineering support.

Scientist looking through microscope



  • Electrical verification (ATE, bench test, temperature, device characterization)
  • Curve trace (IV family of curves)
  • Parametric and functional test
  • Product validation
  • RF characterization
  • Time Domain Reflectometry (TDR)
  • Transmission Line Pulse (TLP)


  • External optical examination
  • Scanning Acoustic Microscopy (SAM)
  • Real Time X-ray analysis (RTX)
  • Thermal measurement and mapping


  • Laser ablation
  • Cu wire
  • Advanced packaging (stacked die, multi-chip module, embedded devices, mounted on PCB)
  • CSP extraction from module and re-ball
  • Die extraction
  • Stacked die separation
  • Jet etch/chemical
  • Mechanical de-lid
  • Oxygen plasma


  • Bright and dark field imaging
  • Nomarski Differential Interference Contrast (DIC)
  • Near-IR inspections through silicon


  • Backside sample preparation and analysis
  • Laser Signal Injection Microscopy (XIVA, OBIRCH, Lock-in Mode, 1340nm, 1064nm)
  • Infrared (IR) Thermography (pulse modulation mode, hot spot, temperature map)
  • Light Emission Microscopy (LEM) or EMMI (InGaAs, Deep Depletion CCD)
  • Microprobing and picoprobing
  • FIB circuit edit and probe points
  • Dopant profiling (AFP SCM)


  • Reactive Ion Etch (RIE)
  • Deprocessing/de-layering (chemical and mechanical)
  • Scanning Electron Microscopy (SEM, FE SEM)
  • Energy Dispersive X-ray Spectroscopy (EDS) spot, dot map and line scan
  • Scanning Transmission Electron Microscopy (STEM)
  • Dual Beam Focused Ion Beam (DB FIB) with GDS navigation and EDS analysis
  • Ion milling and polish
  • Metallurgical cross-sectioning (die, package, PCB, product)
  • Dye and pry (solder joint integrity)
  • Bond strength test (pull and shear)
  • Construction and competitor analysis (process technology and node)


EAG delivers comprehensive design, development, test, analysis and debug services that are differentiated by expert engineering capability and comprehensive capital equipment and processes.

Complete Lifecycle Services of Electronic Components

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