Time Domain Reflectometry (TDR)
Timing measurements of reflected signals in packaged parts. Comparison to a known good part establishes deviation point of failing part. Used to identify location of failure to substrate, interconnect or die.
Each layer in the package may be inspected optically and probed electrically.
EAG has over 30 years supporting companies in the total product lifecycle from conception thru volume production. An example is our testing services which offer 24/7 production, pilot, prototype test and the capability to rent our tools for onsite program.
Many of our clients are not aware that we can also manage the complete backend process where we receive a fabricated wafer ready for testing, perform electrical testing, return to assembly, and once returned, perform final test and QA.
TDR ON BGA, TWO PINS CHECKED
Top layer of substrate removed
Last layer of substrate removed
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