Eurofins EAG Laboratories' Latest Thermal Imaging Capabilities

Eurofins EAG Laboratories has enhanced its thermal imaging capabilities by adding Microsanj equipment that utilizes the principles of thermoreflectance and material index of refraction to provide unmatched spatial and temporal resolution.

The development and adoption of Thermoreflectance (TR) Thermal Imaging was pioneered by Microsanj to address the evolving technologies that utilize new materials with shrinking geometries. These devices have increased construction complexity and high-power densities that require peak electro-thermal performance and reliability.  Industries supported include semiconductors, power electronics, AI, automotive, 5G/6G telecom, photonics, aerospace/military, medical devices, robotics, and cloud computing.

submicron spatial resolution with a GaN device
(Submicron spatial resolution with a GaN device)
Locating small hotspots
(Locating small hotspots)

Advantages:

  • Spatial Resolution (submicron)
  • Temporal Resolution (50 ns)
  • Thermal Resolution (0.2 0C)
  • High Sensitivity (NETD = 10mK with long wave IR imaging, 100mK with TR with 5 min averaging)
  • Dynamic 2D and 3D Imaging
  • Performed at room temperature

Analyses and Applications:

  • Design Characterization, Validation and Modeling
  • Performance Optimization
  • Ultrafast-Transient for Detection and Mapping of Time-Dependent thermal events
  • Failure Analysis

Failures and Samples:

  • Hotspot detection, ESD damage, ohmic shorts and leakage currents.
  • Thermal Mapping for abnormal temperature distribution or uniformity.
  • Characterize and detect rapidly changing thermal behavior over time, bias conditions, etc.
  • Thermal imaging during a Latch-up event.
  • Heat sink integrity assessment.
  • GaN, GaAs, InP, SiC, IGBT, MIMC, HEMT, Si Photonics, etc.
  • Backside imaging for flip-chip mounted devices
Capture and analyze rapidly changing thermal events
(Capture and analyze rapidly changing thermal events)

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Eurofins EAG Laboratories will be presenting “Thermal Oxide Characterization – Heat Treat Modality vs. Composition“ on May 10th. We hope to see you there!

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