Testing for Colorants and Additives like Sudan Red Dye
EAG scientists can not only detect dyes or colorants at low concentrations, but can identify their true identity based on its mass spectral fingerprint.
Experience Next Gen Testing: Quantum Diamond Microscopy to Detect Issues Faster, Reduce Waste, and Improve Yield
Eurofins EAG is expanding its advanced failure analysis portfolio with the addition of a first-of-its-kind tool from QuantumDiamonds GmbH, the QDm.1, bringing cutting-edge quantum sensing capabilities to support increasingly complex device architectures. This quantum diamond microscopy system is engineered to deliver precise failure analysis for heterogeneous integration and advanced packaging technologies.
The system uses a diamond sensor that hosts billions of Nitrogen-Vacancy (NV) centers to perform high-resolution, high-sensitivity magnetic imaging on biased devices through a fluorescence-based sensing mechanism. The system can map the 3D magnetic field generated by current flowing through a sample up to micrometer resolution.
Once the current path within a sample, including its depth, is identified, the defects responsible for leakage or shorting can be located and then examined through established disassembly techniques such as cross-sectioning, FIB, or delayering. This capability also enhances Lock-in Thermography and X-ray analysis by offering novel electrical information.
While this technique delivers value for standard device packaging, its potential is realized in 2.5D/3D heterogeneous integration, advanced packaging, and multi-layer PCB assemblies. In these increasingly complex structures, the ability to determine the in-plane structures and depth of hidden issues provides critical insight.
Eurofins EAG continues to invest in state-of-the-art analytical solutions to support customers as device geometries shrink and complexity grows. The addition of the QDm.1 highlights our commitment to delivering leading insight for the industry’s most challenging materials and electronics problems.
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