Characterization of Crystalline structures – SEM-EBSD vs TEM-PED
Besides images provided by SEM and TEM, different attachments can be added to reveal crystalline information, including (SEM-EBSD) and TEM (TEM-PED).
How EAG Engineering Science Can Help CHIPS Act Projects Succeed
The CHIPS and Science Act is investing to grow the semiconductor industry in the United States. New fabs are coming on-line and R&D teams are pushing the limits of materials and design. CHIPS Act-funded innovation moves fast, but success relies on engineering support to ensure performance and reliability. EAG can help.
With over 20 years in microelectronics, our team has a high level of expertise. Our skilled staff efficiently identify root causes using established processes. With a comprehensive set of advanced tools, our facility prioritizes scalability and flexibility, enabling optimal choices for tools, platforms, and locations for each job. We adopt a multidisciplinary approach, consolidating all services under one roof to offer clients a single point of contact. Our turn-key offerings cover every project aspect, ensuring an efficient and seamless experience.
Advanced testing and engineering services at EAG include:
- ATE Test & Engineering
- Burn-in and Reliability Qualification
- ESD and Latch-Up Testing
- Failure Analysis
- FIB Circuit Edit and Debug
- Advanced Microscopy
- PCB Design & Assembly
- Warpage Analysis
EAG is committed to delivering premier analytical testing services and continuously enhancing our quality management system.
We are compliant with ITAR regulations, ISO 9001:2015, ISO 17025:2017, ISO 27001, and hold DLA certifications for MIL-STD-750 and MIL-STD-883 protocols.
Whether you are in R&D, pilot production, or full-scale manufacturing, EAG offers you the world’s largest and most diverse collection of specialized analytical instrumentation, capacity to perform a variety of microelectronic tests in parallel, and the multi-disciplinary expertise required to critically evaluate results and provide true insight into a solution. Contact us to learn more!
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Composition Analysis on 3D Printed Titanium
XRD analysis provides identification of crystalline phases present. For 3D printed materials that come from a matrix of multiple elements, it can be unclear whether the cooling creates one, consistent phase of material or if it separates out into multiple phases.
Latch-up Testing Webinar
In this webinar we introduce latch-up testing which is relevant for CMOS devices with high static power dissipation.
Elemental Depth Profiling Analysis for the Aerospace & Defense Industry
EAG Scientists utilize GDMS analysis to perform Elemental Depth Profiling for chemical purity evaluations for aerospace & defense.