Multilayer Packaging Film Characterization
Understanding the construction/composition of films is beneficial for a variety of reasons
IRPS 2025 Presentation
March 30 - April 3
We are excited to announce that Eurofins EAG Laboratories will be presenting a poster at the International Reliability Physics Symposium (IRPS) in Monterey, CA, March 30th – April 2nd.
Meet Sinai Galvan as she presents her poster on Wednesday, April 2nd at the Hyatt Regency in Monterey.
Enhanced Dye and Pull for CSP Package Types
Abstract: In this paper, we successfully demonstrate the feasibility of performing Dye and Pull (D&P) Analysis on Chip Scale Package (CSP) types, for which the lab previously experienced structural failure during the pulling process repeatedly which greatly limited the useful information obtained.
More content you might like...
Women in STEM Industry Fair
Women in STEM Career Fair Eurofins EAG Laboratories is excited to host a Women in STEM Career Fair on March 31st from 3 PM – 6 PM ET! We’re looking
Food Investigations and Crisis Management
EAG experts guide manufacturers, processors and distributors through food investigations and help save time and money in crisis management.
Silicon Carbide – A Powerful Semiconductor for the Future
Silicon carbide is increasingly considered a potential replacement for traditional silicon semiconductors due to its superior properties.
Assessment of Nickel Exposure Risk of Intravascular Stents and Delivery Systems
Nickel biocompatibility assessments of intravascular stents from EAG includes evaluating corrosion, surfaces and nickel ion release testing.
Medical Device & Diagnostics for BIOMEDevice
Drive productivity while keeping pace with evolving regulations