Ask the Expert: Residual Gas Analysis

During this live Ask the Expert event we will answer pre-submitted questions from our audience about Residual Gas Analysis.

RGA is a Residual Gas Analysis test that determines the gas mixture inside hermetically sealed devices.  In order to eliminate failures in microelectronic components the internal gas composition of the component must be known. MIL-STD 883 & MIL-STD 750, Method 1018 is the accepted specification for internal gas analysis. Residual Gas Analysis (RGA) is used to quantitatively measure the primary and trace gases inside hermetic devices. This gas content, particularly moisture concentration, can cause long-term reliability problems. Samples of process atmospheres and unusual sealing environments can be analyzed to detect the evolution or resorption of gases. The system software can determine moisture content as well as an entire spectrum of gases in microelectronics, semiconductors, and medical implant.

RGA is ideally suited for process development, sealing quality control, studying long-term outgassing of the enclosed materials inside the components, and for product qualification.

EAG has the technical expertise to identify the problematic gases inside hermetic devices and to advise for corrective measures. We offer over 40 years of combined RGA expertise and are one of two commercial labs in the country and have been granted Defense Logistics Agency (DLA) suitability to perform Mil-STD 883 TM 1018 testing.

Do you want to understand how the gas mixture can ensure the reliability, integrity and longevity of your device.  Are you new to the industry and just want to learn more? Do you simply want to develop a deeper understanding of Residual Gas Analysis?  If so please join us for an intimate Q&A with Eurofins EAG Laboratories Senior Principal Scientist Jayeshkumar Das, Ph.D. During this 30-minute session Dr. Das will answer pre-submitted questions from our audience.  If time runs out and all questions have not been answered a follow up email will be sent out to all attendees with those answers.

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