
A Deep Dive into Dynamic SIMS vs. static-SIMS
Different types of SIMS analyses exist. The two main types include Dynamic SIMS (high current) and static-SIMS (low current).
Depending on our clients’ needs, labs within EAG have various certifications, accreditations, regulatory approvals and/or licenses.
For questions about our quality management system, you can reach our quality team here
EAG is committed to excellence in our professional practices, to offering world-class analytical testing services, and to continually improving our quality management system. Our mission to achieve total customer satisfaction by delivering on-time, accurate analyses is engraved in the backbone of our quality system. In keeping with this commitment, we have a number of controls in place to assure the effectiveness and efficiency of our quality system:
Our testing laboratories are registered with the DDTC (Directorate of Defense Trade Controls). A Technology Control Plan is in place to ensure compliance with all EAR (Export Administration Regulations) and ITAR (International Traffic in Arms Regulations). Our scientists and staff are experienced with the data security requirements in regards to EAR, ITAR and military standards.
You may view and download certifications and accreditations for many of our laboratories below.
International Quality Management Standard
International Standard for calibration and testing laboratories
International Quality Management Standard
For DPA and RGA testing our Labs are suitably equipped to perform testing on military devices for MIL-STD-750 and MIL-STD-883.
Covering electronic components, assemblies, related materials and processes

Different types of SIMS analyses exist. The two main types include Dynamic SIMS (high current) and static-SIMS (low current).

In this webinar we introduce Metal Based Additive Manufacturing Analysis to understand and evaluate many aspects of the metallurgy.

In this webinar we introduce FIB Circuit Edit which allows the cutting of connections and placement of new lines in a semiconductor die

SEM equipped with EDS can capture detailed images and identify elements simultaneously on the surface of samples.
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