Failure Analysis in a Complex World Webinar
In this webinar we show how EAG troubleshoots electronic system failures using a multidisciplinary approach
NEPP Electronics Technology Workshop
August 11 - August 14, 2025
Eurofins EAG Laboratories will be presenting at The 16th Annual NASA Electronic Parts and Packaging (NEPP) Program’s Electronics Technology Workshop (ETW) in Greenbelt, MD. Remote access is available!
Meet Vidu Weerasinghe as he presents, The Future of Failure Analysis, on Wednesday, August 13th, 1:40PM EST/10:40AM PST.
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Analysis of Contaminants by Thermal Desorption GC-MS
Thermal desorption GC/MS – Good vs. failed comparisons for detecting volatile organic components and for semi-quantitative results.
Hydrogen, Carbon, Oxygen and Iron Contamination Measurements in ALD Films using XPS and SIMS
ALD for semiconductors can produce films that are high in H, C, O and metals. XPS and SIMS depth profile analysis for composition & purity.
Characterization of Bioceramics for Surgical Implants: Part I – Precursor Qualification
This paper will demonstrate how analytical tools can be used for the quality control of hydroxyapatite and β-tricalcium phosphate powders
Statistical Analysis of Multilayer Structures in Electron Microscopy Using Image Processing
In this application note, we demonstrate our capability to generate a large number of measurements in a single image to determine the roughness of interfaces in a multilayer stack and the roughness correlation across layers.
Latch-up Testing Webinar
In this webinar we introduce latch-up testing which is relevant for CMOS devices with high static power dissipation.