Chemical Decapsulation
Chemical Decapsulation: Creation of a cavity on the package surface of an electronic component to expose the die underneath for inspection.
NPE 2024 – The Plastics Show
May 6-10, 2024
Eurofins EAG Laboratories will be attending NPE 2024 – The Plastics show in Orlando, Florida in May. Come visit us at booth W5584 to learn more about our services and capabilities.
We hope to see you there!
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Eurofins EAG Laboratories Latest Thermal Imaging Capabilities
Eurofins EAG Laboratories has enhanced its thermal imaging capabilities by adding Microsanj equipment that utilizes the principles of thermoreflectance and material index of refraction to provide unmatched spatial and temporal resolution.
Evaluating the Cleanliness of Medical Devices
Eurofins EAG has a wide array of analytical techniques to verify the cleanliness of medical devices. We’ve helped our customers evaluate the cleanliness of their products using techniques including NVR analysis, often in combination with FTIR, XPS and TOF-SIMS.
Extractables & Leachables West Summit 2025
November 4-5, 2025
Eurofins EAG Laboratories will present at the Extractables & Leachables West Summit, November 4-5, 2025, La Jolla, CA.
Cryo-FIB/SEM: Enhancing Precision and Minimizing Damage in Material Analysis
Cryogenic focused ion beam and scanning electron microscopy is a technique used to reduce damage caused by ion and electron beams.
Increase the Reliability of Products in the Field with DPA
High reliability electronic components like integrated circuits are often required to operate for long periods of time, having little or no opportunity for replacement.