MD&M West 2024

MEDevice Boston 2024

September 25-26, 2024
Eurofins EAG Laboratories will exhibit and co=present with Gradient at MEDevice Boston 2024.

Ask the Expert: Polymeric Material Investigations

During this live Ask the Expert event, we will answer pre-submitted questions from our audience regarding characterization of polymeric materials used for product development, R&D, and failure analysis.

EBSD Webinar

This webinar will focus on Electron Backscatter Diffraction (EBSD) and Electron channeling contrast imaging (ECCI)

EAG Laboratories achieves ISO 27001 certification

6th June 2023
EAG Laboratories has met the requirement of ISO 27001 for managing the risks related to the security of our customers data

Microscopy Techniques in the Failure Analysis of Optoelectronics

EAG divides FA tasks into three levels. In each level, we employ optimal techniques for device characterization, defect localization, and root cause failure analysis.

Comparison of VTD in GaN imaged with conventional TEM bright field (left) and STEM bright field (right)

Rapid Threading Dislocation Typing in GaN Using STEM

STEM provides images of dislocations with simplified contrast, allowing rapid dislocation typing in both cross section and plan view samples.