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Advanced Sample Preparation for Radiation Effects Testing
Space presents one of the harshest environments for electronic components and packages, where they must endure intense and unpredictable dose, intensity, and exposure from natural radiation sources such as Solar Particle Events (SPE), Galactic Cosmic Rays (GCR), and Trapped Particles (TP). These high‑energy particles can disrupt internal circuits, degrade performance, threaten long‑term reliability, or cause catastrophic failures, challenges that are especially critical for satellites, deep‑space missions, and high‑altitude aviation systems.
To mitigate and prevent these issues, researchers developed Radiation Effects Testing, a process where electronic components undergo controlled simulation in specialized facilities to assess and evaluate its effects when exposed to harsh space environments. Out of the various testing methods, the two most utilized are:
- Single Event Effects (SEE) testing, which examines transient or catastrophic failures caused when a single high‑energy particle, such as a heavy ion, proton, or focused laser pulse, strikes sensitive region/s within the component.
- Total Ionizing Dose (TID) testing, which measures the gradual cumulative degradation from prolonged exposure to ionizing radiation sources like gamma rays or X‑rays.
These simulations can help identify vulnerabilities, validate design robustness, and ensure mission‑critical performance, allowing electronics to withstand the harsh conditions of space.
Traditionally, aerospace industries have relied on expensive hermetically sealed space-grade package types for their robust shielding and durability withstanding the harsh space radiation environments. As demand for space missions continues to grow, the aerospace industry is switching to commercial off-the-shelf (COTS) components as a cost-effective alternative. Commercial grade components are generally encapsulated by a molding compound mixture. Most facilities don’t have strong enough radiation sources to be able to test through this outer molding compound layer.
To overcome these challenges, sample preparation techniques are conducted to selectively remove layers of material that may reduce the effects of radiation testing. Removing non-functional layers of the package/assembly will effectively make the devices of interest more susceptible to an equivalent dose of radiation. This can enable testing on encapsulated samples, dramatically reduce beam time, reduce facility costs, and improve the testing accuracy/repeatability.
Sample preparation methods vary depending on the package type, complexity, and end application. These methods are carefully selected to safely and efficiently remove encapsulants, while also preserving their overall electrical functionality and packaging integrity.
For space-grade and/or hermetically sealed packages, which typically use glass, ceramic, or metal lids, de-lidding is generally performed mechanically with precision grinding, cutting tools, or by applying controlled heat.
For plastic-encapsulated packages, decapsulation is performed using laser ablation, wet chemical etching, dry plasma etching, or a combination of these techniques.
For complex packages such as flip-chip devices, backside access is often required, Backside Die Thinning is performed using controlled grinding or chemical-mechanical polishing to reduce silicon thickness. This capability is critical for backside particle penetration during SEE testing, minimizing substrate doping and shielding, enabling other advanced diagnostics such as Laser Pulse/Injection Testing, Failure Analysis, or FIB techniques. See Precise Backside Die-Thinning for extended die-thinning capabilities.
Why Choose EAG?
EAG has broad and practical Failure Analysis expertise in advanced technology part types, and an established, expanding relationship with customers in the aerospace and defense industries, allowing extensive exposure to more complex semiconductor packaging and hands‑on expertise in preparing these devices for radiation testing. From standard packages to complex board mounted assemblies, many of these constructions (i.e., stacked dice, multi-chip modules (MCM), flip-chip, dead-bug, image sensors, etc.) require tailored preparation strategies to access critical regions without compromising structural integrity and overall functionality.
Whether you fully understand a package’s construction or are working with limited information, we offer comprehensive sample preparation consultation throughout the entire process at every stage to identify the most effective approach for each device type and its intended radiation test mode. This includes preliminary feasibility assessments through Non‑Destructive Analysis and/or Destructive Physical Analysis/Construction Analysis to reveal internal structure, examine profile details, and layer stack‑ups when necessary.
This is why we are the ideal partner for sample preparation for your radiation testing campaigns and other complex and challenging projects. Consider EAG your one‑stop solution for all preparation needs, helping you achieve smooth and successful radiation test outcomes.
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