Component Product Qualification Webinar
In this webinar we introduce Microelectronic Component Product Qualification to understand and consider component reliability.
IRPS 2025 Presentation
March 30 - April 3
We are excited to announce that Eurofins EAG Laboratories will be presenting a poster at the International Reliability Physics Symposium (IRPS) in Monterey, CA, March 30th – April 2nd.
Meet Sinai Galvan as she presents her poster on Wednesday, April 2nd at the Hyatt Regency in Monterey.
Enhanced Dye and Pull for CSP Package Types
Abstract: In this paper, we successfully demonstrate the feasibility of performing Dye and Pull (D&P) Analysis on Chip Scale Package (CSP) types, for which the lab previously experienced structural failure during the pulling process repeatedly which greatly limited the useful information obtained.
More content you might like...
Latch-up Testing Webinar
In this webinar we introduce latch-up testing which is relevant for CMOS devices with high static power dissipation.
Environmental Stress Cracking of a Polycarbonate Part
A company was investigating environmental stress cracking of polycarbonate components used in a conveyor device that was sanitized.
Chemicals & Basic Materials Testing
EAG evaluates chemicals & basic materials, helping to improve manufacturing, meet regulations, enhance research and resolve safety concerns.
Low Parasitic HBM Testing
HBM ESD testing (Human Body Model electrostatic Discharge) uses the latest standards and best testing practices, reducing costs and time.
Identifying Contaminants Using Raman Spectroscopy: Organic Particles
Learning the chemical composition of contaminants is challenging with small organic particles – Raman Spectroscopy is often the best approach