We are excited to announce that Eurofins EAG Laboratories will be presenting a poster at the International Reliability Physics Symposium (IRPS) in Monterey, CA, March 30th – April 2nd.
Meet Sinai Galvan as she presents her poster on Wednesday, April 2nd at the Hyatt Regency in Monterey.
Enhanced Dye and Pull for CSP Package Types
Abstract: In this paper, we successfully demonstrate the feasibility of performing Dye and Pull (D&P) Analysis on Chip Scale Package (CSP) types, for which the lab previously experienced structural failure during the pulling process repeatedly which greatly limited the useful information obtained.
At EAG, we deliver specialized analytical services that support testing throughout the battery life cycle including purity testing of raw and recycled materials, materials R&D, battery manufacturing, and failure analysis.
Knowing the type of stress and how much there is in a small metal component in a medical device can be the determining factor on how well the device will perform, how long the device will last, or even whether or not the device is going to work at all.
EAG evaluate corrosion and leaching of nickel-rich implanted medical devices including nitinol, stainless steel and MP35N.
Solving CSP qualification testing challenges by addressing key issues and applying specialized processes through EAG know-how.
EAG Laboratories can test for ionic or covalent bonds at our Sunnyvale, St. Louis, Minneapolis and Eindhoven facilities
In the full webinar we will focus on full survey chemical analysis using solid sampling high resolution GDMS.
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